Data processing device and driving method thereof

ABSTRACT

A data processing device which includes a flexible position input portion for sensing proximity or a touch of an object such as a user&#39;s palm and finger. In the case where a first region of the flexible position input portion is held by a user for a certain period, supply of image signals to the first region is selectively stopped.

TECHNICAL FIELD

The present invention relates to an object, a method, or a manufacturingmethod. In addition, the present invention relates to a process, amachine, manufacture, or a composition of matter. In particular, thepresent invention relates to, for example, a semiconductor device, adisplay device, a light-emitting device, a power storage device, adriving method thereof, or a manufacturing method thereof. Inparticular, the present invention relates to, for example, a method anda program for processing and displaying image information, and a deviceincluding a recording medium in which the program is recorded. Inparticular, the present invention relates to, for example, a method forprocessing and displaying image information by which an image includinginformation processed by an information processor provided with adisplay portion is displayed, a program for displaying an imageincluding information processed by an information processor providedwith a display portion, and an information processor including arecording medium in which the program is recorded.

BACKGROUND ART

Display devices with large screens can display many pieces ofinformation. Therefore, such display devices are excellent inbrowsability and suitable for information processors.

The social infrastructures relating to means for transmittinginformation have advanced. This has made it possible to acquire,process, and send out many pieces and various kinds of information withthe use of an information processor not only at home or office but alsoat other visiting places.

With this being the situation, portable information processors are underactive development.

For example, portable information processors are often used outdoors,and force might be accidentally applied by dropping to the informationprocessors and display devices included in them. As an example of adisplay device that is not easily broken, a display device having highadhesiveness between a structure body by which a light-emitting layer isdivided and a second electrode layer is known (Patent Document 1).

REFERENCE

[Patent Document 1] Japanese Published Patent Application No.2012-190794

DISCLOSURE OF INVENTION

An object of one embodiment of the present invention is to provide anovel human interface with high operability. Another object is toprovide a novel data processing device with high operability. Anotherobject is to provide a novel processing device, a novel display device,or the like. Another object is to provide a data processing device, adisplay device, or the like which consumes low power. Another object isto provide a data processing device, a display device, or the like withfavorable operability. Another object is to provide a data processingdevice, a display device, or the like which can be easily held by auser. Another object is to provide a data processing device, a displaydevice, or the like which is less likely to fall. Another object is toprovide a data processing device, a display device, or the like withfewer malfunctions. Another object is to provide a data processingdevice and a display device that can be easily operated with both hands.

Note that the descriptions of these objects do not disturb the existenceof other objects. In one embodiment of the present invention, there isno need to achieve all the objects. Other objects will be apparent fromand can be derived from the description of the specification, thedrawings, the claims, and the like.

One embodiment of the present invention is a data processing deviceincluding an input/output unit that supplies positional data andreceives image data, an arithmetic unit that receives the positionaldata and supplies the image data. The input/output unit includes aposition input portion and a display portion. The position input portionis flexible to be bent such that a first region, a second region facingthe first region, and a third region between the first region and thesecond region are formed. The display portion is provided to overlapwith at least part of the first region, the second region, or the thirdregion. The arithmetic unit includes an arithmetic portion and a memoryportion that stores a program to be executed by the arithmetic portion,and supplies image data to the display portion based on the positionaldata.

Another embodiment of the present invention is a data processing deviceincluding an input unit having a plurality of regions provided with asensor portion that senses proximity or a touch of the object, anarithmetic portion that determines a proximity operation or a contactoperation over a sensor portion, and a display device havingflexibility. In the case where the specific proximity operation orcontact operation is performed in the plurality of regions at the sametime, predetermined processing is carried out.

One embodiment of the present invention is a method for driving a dataprocessing device including an input unit provided with a sensor portionthat senses proximity or a touch of an object and a display unitprovided with a display portion for displaying images. The sensorportion and the display portion overlaps with each other. The dataprocessing device determines the first region over the sensor portion inwhich proximity or touch of an object is sensed for a predeterminedtime, and image signals are not provided to the second region over thedisplay portion which overlaps with the first region.

Another embodiment of the present invention is a driving method of adata processing device including an input unit provided with a sensorportion for sensing proximity or a touch of an object, and an arithmeticportion for determining a proximity operation or a contact operationover the sensor portion. The data processing device detects a regionover the sensor portion in which proximity or contact of an object issensed for a predetermined time is determined, so that the region isexcluded from a subject of determination of the proximity operation orthe contact operation.

Another embodiment of the present invention is a driving method of adata processing device in which whether the data processing device isoperated by one hand or whether it is operated with both hands isdetermined, and an image based on the determination result is displayed.

In one embodiment of the present invention, a human interface with highoperability can be provided. Furthermore, a novel data processing devicewith high operability can be provided. A novel data processing device ora novel display device can be provided. Furthermore, a data processingdevice, a display device, and the like which consume low power can beprovided. A data processing device, a display device, and the like withhigh operability can be provided. A data processing device, displaydevice, and the like which can be held easily can be provided. A dataprocessing device, a display device, and the like which are less likelyto fall can be provided. A data processing device, a display device, andthe like with fewer malfunctions can be provided. A data processingdevice, a display device, and the like which is easily operated by bothhands can be provided. Note that the description of these effects doesnot disturb the existence of other effects. One embodiment of thepresent invention does not necessarily achieve all the objects listedabove. Other effects will be apparent from and can be derived from thedescription of the specification, the drawings, the claims, and thelike.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a block diagram illustrating a structure of a data processingdevice of an embodiment.

FIGS. 2A to 2E illustrate structures of a data processing device and aposition input portion of an embodiment.

FIGS. 3A to 3C illustrate structures of a data processing device and aposition input portion of an embodiment.

FIGS. 4A to 4H illustrate structures of a data processing device and aposition input portion of an embodiment.

FIGS. 5A and 5B are schematic views illustrating a structure of a dataprocessing device of an embodiment.

FIGS. 6A and 6B are schematic views illustrating a structure of a dataprocessing device of an embodiment.

FIGS. 7A1, 7A2, 7B1, and 7B2 are schematic views illustrating structuresof data processing devices of embodiments.

FIGS. 8A1, 8A2, 8B1, and 8B2 are schematic views illustrating structuresof data processing device of embodiments.

FIGS. 9A1, 9A2, 9B1, and 9B2 are schematic views illustrating astructure of data processing devices of embodiments.

FIGS. 10A1, 10A2, and 10B illustrate a structure of a position inputportion of an embodiment.

FIG. 11 is a block diagram illustrating a structure of a data processingdevice of an embodiment.

FIG. 12A illustrates a structure of a data processing device of anembodiment, and FIGS. 12B and 12C illustrate an unfolded state and anfolded state of the data processing device.

FIGS. 13A to 13E illustrate a structure of a data processing device ofan embodiment.

FIGS. 14A1, 14A2, 14B1, and 14B2 illustrate a data processing device ofan embodiment held by a user.

FIGS. 15A and 15B illustrate a data processing device of an embodimentheld by a user.

FIGS. 16A and 16B are flow charts showing a program to be executed by anarithmetic portion of a data processing device of an embodiment.

FIGS. 17A to 17C illustrate structures of a data processing device and aposition input portion of an embodiment

FIGS. 18A to 18D illustrate structures of a data processing device and aposition input portion of an embodiment.

FIGS. 19A and 19B illustrate application examples of a data processingdevice of an embodiment.

FIG. 20 is a flow chart showing a program to be executed by anarithmetic portion of a data processing device of an embodiment.

FIGS. 21A to 21C illustrate an example of an image displayed on adisplay portion of a data processing device of an embodiment.

FIG. 22 is a flow chart showing a program to be executed by anarithmetic portion of a data processing device in one embodiment.

FIG. 23 is a flow chart showing a program to be executed by anarithmetic portion of a data processing device of one embodiment.

FIG. 24 is a flow chart showing a program to be executed by anarithmetic portion of a data processing device of one embodiment.

FIG. 25 illustrates an application example of a data processing deviceof an embodiment.

FIGS. 26A to 26C illustrate structures of a display panel that can beused for a display device of an embodiment.

FIGS. 27A and 27B illustrate a structure of a display panel that can beused for a display device of an embodiment.

FIG. 28 illustrates a structure of a display panel that can be used fora display device of an embodiment.

FIGS. 29A to 29D illustrate a method for manufacturing a foldablefunctional element of one embodiment.

FIGS. 30A to 30D illustrate a method for manufacturing a foldablefunctional element of an embodiment.

FIGS. 31A to 31D illustrate a method for manufacturing a foldablefunctional element of an embodiment.

FIGS. 32A and 32B illustrate application examples of a data processingdevice of an embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiments will be described in detail with reference to drawings. Notethat the present invention is not limited to the description below, andit is easily understood by those skilled in the art that various changesand modifications can be made without departing from the spirit andscope of the present invention. Accordingly, the present inventionshould not be interpreted as being limited to the content of theembodiments below. Note that in the structures of the inventiondescribed below, the same portions or portions having similar functionsare denoted by the same reference numerals in different drawings, anddescription of such portions is not repeated.

The position, size, range, and the like of each component illustrated inthe drawings and the like are not accurately represented in some casesto facilitate understanding of the invention. Therefore, the disclosedinvention is not necessarily limited to the position, the size, therange, or the like disclosed in the drawings and the like. For example,the position, size, range, and the like of each component are notillustrated in some cases for easy understanding.

Note that the term “over” or “below” in this specification and the likedoes not necessarily mean that a component is placed directly on ordirectly below and directly in contact with another component. Forexample, the expression “electrode B over insulating layer A” does notnecessarily mean that the electrode B is on and in direct contact withthe insulating layer A and can mean the case where another component isprovided between the insulating layer A and the electrode B.

Note that ordinal numbers such as “first” and “second” and the like inthis specification and the like are used in order to avoid confusionamong components and do not denote the priority or the order such as theorder of steps or the stacking order. A term without an ordinal numberin this specification and the like might be provided with an ordinalnumber in a claim in order to avoid confusion among components. Inaddition, a term with an ordinal number in this specification and thelike may be provided with a different ordinal number in a claim.

In this specification and the like, “touch” means contacting with asurface of a data processing device by part of the body of a user suchas a finger or a tool such as a stylus. In this specification and thelike, “tap” means hitting the surface of the data processing device withpart of the body of a user such as a finger or a tool such as a stylus.In this specification and the like, “flick” means sliding part of thebody of a user or a tool such as a stylus on the surface of the dataprocessing device. In this specification and the like, “drag” meansselecting part or all of an image displayed on a display portion andmoving the selected image by “flick” by part of the body of a user suchas a finger or a tool such as a stylus. In this specification and thelike, “pinch in” means sliding two fingers on the surface of the dataprocessing device as if pinching an object. In this specification andthe like, “pinch out” means sliding two fingers on the surface of thedata processing device so that they are away from each other. In thisspecification and the like, a proximity operation and a contactoperation performed over a sensor portion, such as “touch”, “tap”,“flick”, “drag”, “pinch in”, and “pinch out” are collectively referredto as “touch action”.

Embodiment 1

In this embodiment, a structure of a data processing device of oneembodiment of the present invention will be described with reference todrawings.

FIG. 1 shows a block diagram of a structure of a data processing device100 of one embodiment of the present invention.

FIG. 2A is a schematic view illustrating the external appearance of thedata processing device 100 of one embodiment of the present invention,and FIG. 2B is a cross-sectional view illustrating a cross-sectionalstructure along a cutting-plane line X1-X2 in FIG. 2A. FIGS. 2C and 2Dare schematic views illustrating the external appearance of the dataprocessing device 100 of one embodiment of the present invention, andFIG. 2E is a cross-sectional view illustrating a cross-sectionalstructure along a cutting-plane line X3-X4 in FIGS. 2C and 2D. FIG. 2Cis a schematic view illustrating a front surface of the data processingdevice 100. FIG. 2D is a schematic view illustrating a back surface ofthe data processing device 100.

FIG. 3A is a schematic view illustrating the external appearance of thedata processing device 100 of one embodiment of the present invention,and FIG. 3B is a cross-sectional view illustrating a cross-sectionalstructure along a cutting-plane line X5-X6 in FIG. 3A. FIG. 3C is across sectional view illustrating an example of a cross-sectionalstructure which is different from that of FIG. 3B.

FIG. 4A is a schematic view illustrating the external appearance of thedata processing device 100 of one embodiment of the present invention,and FIG. 4B is a cross-sectional view illustrating a cross-sectionalstructure along a cutting-plane line X7-X8 in FIG. 4A. FIGS. 4C to 4Hare cross-sectional views illustrating examples of cross-sectionalstructures which are different from those of FIG. 4B.

As illustrated in FIGS. 2C and 2D, and FIG. 3C, a position input portion140 or a display portion 130 may be provided not only on the frontsurface but also on the side surface or the back surface of the dataprocessing device 100. As illustrated in FIG. 3A, the position inputportion 140 or the display portion 130 may also be provided on the topsurface of the data processing device 100. The position input portion140 or the display portion 130 may also be provided on the bottomsurface of the data processing device 100. As illustrated in FIGS. 4Aand FIG. 4B that is a cross-sectional view of FIG. 4A, the positioninput portion 140 and the display portion 130 are not necessarilyprovided on the side surface, the top surface or the back surface of thedata processing device 100.

For example, a structure illustrated in FIGS. 5A and 5B may be employed.FIG. 5A is a schematic perspective view of the front surface side of thedata processing device, and FIG. 5B is a schematic perspective view ofthe back surface side thereof. Alternatively, a structure illustrated inFIGS. 6A and 6B may be employed. FIG. 6A is a schematic perspective viewof the front surface side of the data processing device, and FIG. 6B isa schematic perspective view of the back surface side thereof.Alternatively, a structure illustrated in FIGS. 7A1 and 7A2 may beemployed. FIG. 7A1 is a schematic perspective view of the front surfaceside of the data processing device, and FIG. 7A2 is a schematicperspective view of the back surface side thereof. In addition, astructure illustrated in FIGS. 7B1 and 7B2 may be employed. FIG. 7B1 isa schematic perspective view of the front surface side of the dataprocessing device, and FIG. 7B2 is a schematic perspective view of theback surface side thereof. In addition, a structure illustrated in FIGS.8A1 and 8A2 may be employed. FIG. 8A1 is a schematic perspective view ofthe front surface side of the data processing device, and FIG. 8A2 is aschematic perspective view of the back surface side thereof. Inaddition, a structure illustrated in FIGS. 8B1 and 8B2 may be employed.FIG. 8B1 is a schematic perspective view of the front surface side ofthe data processing device, and FIG. 8B2 is a schematic perspective viewof the back surface side thereof. In addition, a structure illustratedin FIGS. 9A1 and 9A2 may be employed. FIG. 9A1 is a schematicperspective view of the front surface side of the data processingdevice, and FIG. 9A2 is a schematic perspective view of the back surfaceside thereof. In addition, a structure illustrated in FIGS. 9B1 and 9B2may be employed. FIG. 9B1 is a schematic perspective view of the frontsurface side of the data processing device, and FIG. 9B2 is a schematicperspective view of the back surface side thereof.

Note that in addition to the position input portion 140, a hardwarebutton, an external connection terminal, and the like may be provided onthe surface of a housing 101.

With such a structure, images can be displayed not only on the planeparallel to the front surface of the housing like in a conventional dataprocessing device but also on the side surface of the housing. Inparticular, display regions are preferably provided along the two ormore side surfaces of the housing because the variety of display isfurther increased.

A display region provided along the front surface of the data processingdevice and display regions provided along the side surface thereof maybe independently used as display regions to display different images orthe like, or two or more of the display regions may display one image orthe like. For example, a continuous image may be displayed on thedisplay region provided along the front surface of the data processingdevice and the display region provided along the side surface thereofand the like.

FIG. 10A1 is a schematic view illustrating arrangement of a positioninput portion 140 and the display portion 130 that can be employed inthe data processing device 100 of one embodiment of the presentinvention, and FIG. 10A2 is a schematic view illustrating arrangement ofproximity sensors 142 of the position input portion 140.

FIG. 10B is a cross-sectional view illustrating a cross-sectionalstructure of the position input portion 140 along a cutting-plane lineX9-X10 in FIG. 10A2.

<Example of Structure of Data Processing Device>

The data processing device 100 described here includes an input/outputunit 120 which supplies positional data L-INF and to which image dataVIDEO is supplied and an arithmetic unit 110 to which the positionaldata L-INF is supplied and supplies the image data VIDEO (see FIG. 1).

The input/output unit 120 includes the position input portion 140 whichsupplies the positional data L-INF and the display portion 130 to whichthe image data VIDEO is supplied.

The position input portion 140 is flexible to be bent such that, forexample, a first region 140(1), a second region 140(2) facing the firstregion 140(1), and a third region 140(3) between the first region 140(1)and the second region 140(2) are formed (see FIG. 2B). For anotherexample, the position input portion 140 is flexible to be folded, suchthat the first region 140(1), the third region 140(3), and a fourthregion 140(4) facing the third region 140(3) are formed (see FIG. 2E).

For another example, the position input portion 140 is flexible to befolded, such that the third region 140(3), a fifth region 140(5), thefourth region 140(4) facing the third region 140(3) are formed (see FIG.3C).

Note that the surfaces or regions may be provided with the respectiveposition input portions 140. For example, as illustrated in FIGS. 4C,4D, and 4E, position input portions 140(A), 140(B), 140(C), 140(D), and140(E) may be provided in the respective regions. Alternatively, astructure may be employed in which some of the position input portions140(A), 140(B), 140(C), 140(D), and 140(E) are not provided asillustrated in FIG. 4F. As illustrated in FIGS. 4G and 4H, the positioninput portion may be provided around the entire inside surface of ahousing.

Note that the second region 140(2) may face the first region 140(1) withor without an inclination. Note that the fourth region 140(4) may facethe third region 140(3) with or without an inclination.

The display portion 130 is supplied with the image data VIDEO and isprovided to overlap with at least part of the first region 140(1), thesecond region 140(2), the third region 140(3), the fourth region 140(4),or the fifth region 140(5). The arithmetic unit 110 includes anarithmetic portion 111 and a memory portion 112 that stores a program tobe executed by the arithmetic portion 111 (see FIG. 1).

The data processing device 100 includes the flexible position inputportion 140 sensing proximity or touch of an object. The position inputportion 140 can be bent such that the first region 140(1), the secondregion 140(2) facing the first region 140(1), and the third region140(3) positioned between the first region 140(1) and the second region140(2) and overlapping with the display portion 130 are formed, forexample. With this structure, whether or not a palm or a finger isproximate to or touches the first region 140(1), the second region140(2), or the like can be determined. As a result, a human interfacewith high operability can be provided. Furthermore, a novel dataprocessing device with high operability can be provided.

Individual components included in the data processing device 100 aredescribed below (see FIG. 1). Note that these units can not be clearlydistinguished and one unit also serves as another unit or include partof another unit in some cases.

For example, a touch panel in which a touch sensor overlaps with adisplay portion is provided over the position input portion 140 as wellas over the display portion 130.

<<Input/Output Device>>

The input/output unit 120 includes the position input portion 140 andthe display portion 130. An input/output portion 145, a sensor portion150, a communication portion 160, and the like may also be included. Theinput/output unit 120 is supplied with data and can supply data (seeFIG. 1).

<<Position Input Portion>>

The position input portion 140 supplies the positional data L-INF. Theuser of the data processing device 100 can supply the positional dataL-INF to the position input portion 140 by touching the position inputportion 140 with his/her finger or palm and thereby supplying a varietyof operation instructions to the data processing device 100. Forexample, an operation instruction including a termination instruction(an instruction to terminate the program) can be supplied (see FIG. 1).

The position input portion 140 includes, for example, the first region140(1), the second region 140(2), and the third region 140(3) betweenthe first region 140(1) and the second region 140(2) (see FIG. 10A1). Ineach of the first region 140(1), the second region 140(2), and the thirdregion 140(3), the proximity sensors 142 are arranged in matrix (seeFIG. 10A2).

The position input portion 140 includes, for example, a flexiblesubstrate 141 and the proximity sensors 142 over the flexible substrate141 (see FIG. 10B).

The position input portion 140 can be bent such that the second region140(2) and the first region 140(1) face each other (see FIG. 2B).

The third region 140(3) of the position input portion 140 overlaps withthe display portion 130 (see FIGS. 2B and 10A1). Note that when thethird region 140(3) is positioned closer to the user than the displayportion 130 is, the third region 140(3) has a light-transmittingproperty.

The distance between the second region and the first region of theposition input portion 140 in a bent state is one that allows the userof the data processing device 100 to hold it in his/her hand (see FIG.14A1). The distance is, for example, 17 cm or shorter, preferably 9 cmor shorter, further preferably 7 cm or shorter. When the distance isshort, the thumb of the holding hand can be used to input the positionaldata to a wide range of the third region 140(3).

Thus, the user of the data processing device 100 can use the dataprocessing device 100, holding it with the thumb joint portion (thevicinity of the thenar) being proximate to or touching one of the firstregion 140(1) and the second region 140(2), and a finger(s) other thanthe thumb being proximate to or touching the other.

The shape of the thumb joint portion (the vicinity of the thenar) beingproximate to or touching one of the first region 140(1) and the secondregion 140(2) is different from the shape(s) of the finger(s) other thanthe thumb being proximate to or touching the other region; therefore,the first region 140(1) supplies positional data different from thatsupplied by the second region 140(2). Specifically, the shape of thethumb joint portion (the vicinity of the thenar) being proximate to ortouching one region is larger than the shape(s) of the finger(s) otherthan the thumb being proximate to or touching the other region or iscontinuous (not divided), for example.

The proximity sensor 142 is a sensor that can sense proximity or touchof an object (e.g., a finger or a palm), and a capacitor or an imagingelement can be used as the proximity sensor. Note that a substrateprovided with capacitors arranged in matrix can be referred to as acapacitive touch sensor, and a substrate provided with an imagingelement can be referred to as an optical touch sensor.

For the flexible substrate 141, a resin thin enough to be flexible canbe used. Examples of the resin include polyester, polyolefin, polyamide,polyimide, aramid, epoxy, polycarbonate, and an acrylic resin.

As a normal substrate not having flexibility, a glass substrate, aquartz substrate, a semiconductor substrate, or the like can be used.

Specific examples of a structure that can be employed in the positioninput portion 140 are described in Embodiments 6 and 7.

<<Display Portion>>

The display portion 130 and at least the third region 140(3) of theposition input portion 140 overlap with each other. Not only the thirdregion 140(3) but also the first region 140(1) and/or the second region140(2) may overlap with the display portion 130.

There is no particular limitation on the display portion 130 as long asthe display portion 130 can display the supplied image data VIDEO.

An operation instruction associated with a portion of the displayportion 130 with which the first region 140(1) and/or the second region140(2) overlap(s) may be different from an operation instructionassociated with a portion of the display portion 130 with which thethird region 140(3) overlaps.

The user can thus see, from display on the display portion, whatoperation instruction is associated with the portion with which thefirst region 140(1) and/or the second region 140(2) overlap(s).Consequently, a variety of operation instructions can be associated.Moreover, false input of an operation instruction can be reduced.

Specific examples of a structure that can be employed in the displayportion 130 are described in Embodiments 6 and 7.

<<Arithmetic Unit>>

The arithmetic unit 110 includes the arithmetic portion 111, the memoryportion 112, an input/output interface 115, and a transmission path 114(see FIG. 1).

The arithmetic unit 110 is supplied with the positional data L-INF andsupplies the image data VIDEO.

For example, the arithmetic unit 110 supplies the image data VIDEOincluding an image used for operation of the data processing device 100,and the input/output unit 120 is supplied with the image data VIDEOincluding the image used for operation. The display portion 130 displaysthe image used for operation.

By touching a portion of the third region 140(3) overlapping with thedisplay portion 130 in which an image used for operation is displayedwith his/her finger, the user can supply the positional data L-INF forselecting the image.

<<Arithmetic Portion>>

The arithmetic portion 111 executes the program stored in the memoryportion 112. For example, in response to supply of the positional dataL-INF that is associated with a position in which an image used foroperation is displayed, the arithmetic portion 111 executes a programassociated with the image.

<<Memory Portion>>

The memory portion 112 stores the program to be executed by thearithmetic portion 111.

Note that examples of a program to be executed by the arithmetic unit110 are described in other embodiments.

<<Input/Output Interface and Transmission Path>>

The input/output interface 115 supplies data and is supplied with data.

The transmission path 114 can supply data, and the arithmetic portion111, the memory portion 112, and the input/output interface 115 aresupplied with data. In addition, the arithmetic portion 111, the memoryportion 112, and the input/output interface 115 can supply data and thetransmission path 114 is supplied with data.

The data processing device 100 includes the arithmetic unit 110, theinput/output unit 120, and the housing 101 (see FIG. 1 and FIG. 2B).

<<Sensor Portion>>

The sensor portion 150 senses the states of the data processing device100 and the circumstances and supplies sensing data SENS (see FIG. 1).

Note that the sensor portion 150 senses, for example, acceleration, adirection, pressure, a global positioning system (GPS) signal,temperature, humidity, or the like and may supply data thereon.

<<Communication Unit>>

The communication portion 160 supplies data COM supplied by thearithmetic unit 110 to a device or a communication network outside thedata processing device 100. Furthermore, the communication portion 160acquires the data COM from the device or communication network outsidethe data processing device 100 and supplies the data COM.

The data COM can include a variety of instructions and the like. Forexample, the data COM can include a display instruction to make thearithmetic portion 111 generate or delete the image data VIDEO.

A communication unit for connection to the external device or externalcommunication network, e.g., a hub, a router, or a modem, can be usedfor the communication portion 160. Note that the connection method isnot limited to a method using a wire, and a wireless method (e.g., radiowave or infrared rays) may be used.

<<Input/Output Unit>>

As the input/output portion 145, for example, a camera, a microphone, aread-only external memory portion, an external memory portion, ascanner, a speaker, or a printer can be used (see FIG. 1).

Specifically, as a camera, a digital camera, digital video camera, orthe like can be used.

As an external memory portion, a hard disk, a removable memory, or thelike can be used. As a read-only external memory portion, a CD-ROM, aDVD-ROM, or the like can be used.

<<Housing>>

The housing 101 protects the arithmetic unit 110 and the like fromexternal stress.

The housing 101 can be formed using metal, plastic, glass, ceramics, orthe like.

This embodiment can be combined with any of the other embodiments inthis specification as appropriate.

Embodiment 2

In this embodiment, the structure of the data processing device of oneembodiment of the present invention will be described with reference todrawings.

FIG. 11 shows a block diagram of a structure of a data processing device100B of one embodiment of the present invention.

FIGS. 12A to 12C are schematic views illustrating the externalappearance of the data processing device 100B. FIG. 12A is the schematicview illustrating the external appearance of the data processing device100B in an unfolded state, FIG. 12B is the schematic view illustratingthe external appearance of the data processing device 100B in a bentstate, and FIG. 12C is the schematic view illustrating the externalappearance of the data processing device 100B in a folded state.

FIGS. 13A to 13E are schematic views illustrating the structures of thedata processing device 100B. FIGS. 13A to 13D illustrate the structurein an unfolded state and FIG. 13E illustrates the structure in a foldedstate.

FIG. 13A is a top view of the data processing device 100B, FIG. 13B is abottom view of the data processing device 100B, and FIG. 13C is a sideview of the data processing device 100B. FIG. 13D is a cross-sectionalview illustrating a cross section of the data processing device 100Btaken along a cutting-plane line Y1-Y2 in FIG. 13A. FIG. 13E is a sideview of the data processing device 100B in the folded state.

<Example of Structure of Data processing Device>

The data processing device 100B described here includes an input/outputunit 120B which supplies the positional data L-INF and the sensing dataSENS including folding data and to which the image data VIDEO issupplied and the arithmetic unit 110 to which the positional data L-INFand the sensing data SENS including the folding data are supplied andwhich supplies the image data VIDEO (see FIG. 11).

The input/output unit 120B includes a position input portion 140B, thedisplay portion 130, and the sensor portion 150.

The position input portion 140B is flexible to be unfolded or foldedsuch that the first region 140B(1), the second region 140B(2) facing thefirst region 140B(1), and the third region 140B(3) between the firstregion 140B(1) and the second region 140B(2) are formed (see FIGS. 12Ato 12C and FIGS. 13A to 13E).

The sensor portion 150 includes a folding sensor 151 capable of sensinga folded state of the position input portion 140B and supplying thesensing data SENS including the folding data.

The display portion 130 is supplied with the image data VIDEO and ispositioned so that the display portion 130 and the third region 140B(3)overlap with each other. The arithmetic unit 110 includes the arithmeticportion 111 and the memory portion 112 that stores the program to beexecuted by the arithmetic portion 111 (see FIG. 13D).

The data processing device 100B described here includes the flexibleposition input portion 140B sensing a palm or a finger that is proximateto the first region 140B(1), the second region 140B(2) facing the firstregion 140B(1) in the folded state, and the third region 140B(3)positioned between the first region 140B(1) and the second region140B(2) and overlapping with the display portion 130; and the sensorportion 150 including the folding sensor 151 capable of determiningwhether the flexible position input portion 140B is in a folded state oran unfolded state (see FIG. 11 and FIGS. 13A to 13E). With thisstructure, whether or not a palm or a finger is proximate to the firstregion 140B(1) or the second region 140B(2) can be determined. As aresult, a human interface with high operability can be provided.Furthermore, a novel data processing device with high operability can beprovided.

Individual components included in the data processing device 100B aredescribed below. Note that these units can not be clearly distinguishedand one unit also serves as another unit or include part of another unitin some cases.

For example, a touch panel in which a touch sensor overlaps with adisplay portion is provided over the position input portion 140B as wellas over the display portion 130.

The data processing device 100B is different from the data processingdevice described in Embodiment 1 in that the position input portion 140Bis flexible to be in an unfolded state or a folded state and that thesensor portion 150 in the input/output unit 120B includes the foldingsensor 151. Different structures will be described in detail below, andthe above description is referred to for the other similar structures.

<<Input/Output Device>>

The input/output unit 120B includes the position input portion 140B, thedisplay portion 130, and the sensor portion 150 including the foldingsensor 151. The input/output portion 145, a sign 159, the communicationportion 160, and the like may also be included. The input/output unit120B is supplied with data and can supply data (FIG. 11).

<<Structure Enabling Folding and Unfolding of Data Processing Device>>

The data processing device 100B has a housing in which a highflexibility portion E1 and a low flexibility portion E2 are alternatelyprovided. In other words, in the housing of the data processing device100B, the high flexibility portion E1 and the low flexibility portion E2are strip-like portions (form stripes) (see FIGS. 13A and 13B).

The above-described structure allows the data processing device 100B tobe folded (see FIGS. 12A to 12C). The data processing device 100B in afolded state is highly portable. It is possible to fold the dataprocessing device 100B such that part of the third region 140B(3) of theposition input portion 140B is on the outer side and use only part ofthe third region 140B(3) (see FIG. 12C).

The high flexibility portion E1 and the low flexibility portion E2 canhave a shape both sides of which are parallel to each other, atriangular shape, a trapezoidal shape, a fan shape, or the like.

The user of the data processing device 100B folded to a size that allowsthe data processing device to be held in one hand can operate part ofthe third region 140B(3) of the position input portion with the thumb ofhis/her hand supporting the data processing device and input positionaldata. In the above manner, the data processing device that can beoperated with one hand can be provided (see FIG. 15A).

Note that in a folded state such that parts of the position inputportion 140 are on the inner side, the user cannot operate part of thethird region 140B(3) (see FIG. 12C). Thus, it is possible to stopdriving of part of the third region 140B(3) of the position inputportion in a folded state. In that case, the data processing device 100Bcan have reduced power consumption with the position input portion in afolded state.

The position input portion 140B in an unfolded state is seamless and hasa wide operation region.

The display portion 130 and the third region 140B(3) of the positioninput portion overlap with each other (see FIG. 13D). The position inputportion 140B is interposed between a connecting member 13 a and aconnecting member 13 b. The connecting member 13 a and the connectingmember 13 b are interposed between a supporting member 15 a and asupporting member 15 b (see FIG. 13C).

The display portion 130, the position input portion 140B, the connectingmember 13 a, the connecting member 13 b, the supporting member 15 a, andthe supporting member 15 b are fixed by any of a variety of methods; forexample, it is possible to use an adhesive, a screw, structures that canbe fit with each other, or the like.

<<High Flexibility Portion>>

The high flexibility portion E1 is bendable and functions as a hinge.

The high flexibility portion E1 includes the connecting member 13 a andthe connecting member 13 b overlapping with each other (see FIGS. 13A to13C).

<<Low Flexibility Portion>>

The low flexibility portion E2 includes at least one of the supportingmember 15 a and the supporting member 15 b. For example, the lowflexibility portion E2 includes the supporting member 15 a and thesupporting member 15 b overlapping with each other. Note that when onlythe supporting member 15 b is included, the weight and thickness of thelow flexibility portion E2 can be reduced.

<<Connecting Member>>

The connecting member 13 a and the connecting member 13 b are flexible.For example, flexible plastic, metal, alloy and/or rubber can be used asthe connecting member 13 a and the connecting member 13 b. Specifically,silicone rubber can be used as the connecting member 13 a and theconnecting member 13 b.

<<Supporting Member>>

Any one of the supporting member 15 a and the supporting member 15 b haslower flexibility than the connecting member 13 a and the connectingmember 13 b. The supporting member 15 a or the supporting member 15 bcan increase the mechanical strength of the position input portion 140Band protect the position input portion 140B from breakage.

For example, plastic, metal, alloy, rubber, or the like can be used asthe supporting member 15 a or the supporting member 15 b. The connectingmember 13 a, the connecting member 13 b, the supporting member 15 a, orthe supporting member 15 b formed using plastic, rubber, or the like canbe lightweight or break-resistant.

Specifically, engineering plastic or silicone rubber can be used.Stainless steel, aluminum, magnesium alloy, or the like can also be usedfor the supporting member 15 a and the supporting member 15 b.

<<Position Input Portion>>

The position input portion 140B can be in an unfolded state or a foldedstate (see FIGS. 12A to 12C).

The third region 140B(3) in an unfolded state is positioned on a topsurface of the data processing device 100B (see FIG. 13C), and the thirdregion 140B(3) in a folded state is positioned on the top surface and aside surface of the data processing device 100B (see FIG. 13E).

The usable area of the unfolded position input portion 140B is largerthan that of the folded position input portion 140B.

When the position input portion 140B is folded, an operation instructionthat is different from an operation instruction associated with aportion of the third region 140B(3) on the top surface of the dataprocessing device 100B can be associated with a portion of the thirdregion 140B(3) on the side surface of the data processing device 100B.Note that an operation instruction that is different from an operationinstruction associated with the second region 140B(2) may be associatedwith the portion of the third region 140B(3) on the side surface of thedata processing device 100B. In this manner, a complex operationinstruction can be given with the use of the position input portion140B.

The position input portion 140B supplies the positional data L-INF (seeFIG. 11).

The position input portion 140B is provided between the supportingmember 15 a and the supporting member 15 b. The position input portion140B may be interposed between the connecting member 13 a and theconnecting member 13 b.

The position input portion 140B includes the first region 140B(1), thesecond region 140B(2), and the third region 140B(3) between the firstregion 140B(1) and the second region 140B(2) (see FIG. 13D).

The position input portion 140B includes a flexible substrate andproximity sensors over the flexible substrate. In each of the firstregion 140B(1), the second region 140B(2), and the third region 140B(3),the proximity sensors are arranged in matrix.

Specific examples of a structure that can be employed in the positioninput portion 140B are described in Embodiments 6 and 7.

<<Sensor Portion and Sign>>

The data processing device 100B includes the sensor portion 150. Thesensor portion 150 includes the folding sensor 151 (see FIG. 11).

The folding sensor 151 and the sign 159 are positioned in the dataprocessing device 100B so that a folded state of the position inputportion 140B can be sensed (FIGS. 12A and 12B and FIGS. 13A, 13C, and13E).

In a state where the position input portion 140B is unfolded, the sign159 is positioned away from the folding sensor 151 (see FIG. 12A andFIGS. 13A and 13C).

In a state where the position input portion 140B is bent at theconnecting members 13 a, the sign 159 is close to the folding sensor 151(see FIG. 12B).

In a state where the position input portion 140B is folded at theconnecting members 13 a, the sign 159 faces the folding sensor 151 (seeFIG. 13E).

The sensor portion 150 senses the sign 159 to determine that theposition input portion 140B is in a folded state and supplies thesensing data SENS including folding data.

<<Display Portion>>

The display portion 130 and at least part of the third region 140(3) ofthe position input portion 140 overlap with each other. The displayportion 130 can display the supplied image data VIDEO.

Particularly when flexible, the display portion 130 can be unfolded orfolded with the position input portion 140 overlapping with the displayportion 130. Thus, seamless display with excellent browsability can beperformed by the display portion 130.

Specific examples of a structure that can be employed in the flexibledisplay portion 130 are described in Embodiments 6 and 7.

<<Arithmetic Unit>>

The arithmetic unit 110 includes the arithmetic portion 111, the memoryportion 112, an input/output interface 115, and a transmission path 114(see FIG. 11).

This embodiment can be combined with any of the other embodiments inthis specification as appropriate.

Embodiment 3

In this embodiment, a structure of a data processing device of oneembodiment of the present invention will be described with reference todrawings.

FIGS. 14A1, 14A2, 14B1, and 14B2 illustrate a state where the dataprocessing device 100 of one embodiment of the present invention is heldby a user. FIG. 14A1 illustrates the external appearance of the dataprocessing device 100 held by a user, and FIG. 14A2 illustrates theranges of a palm and fingers holding the data processing device 100 thatare sensed by the proximity sensor in the position input portion 140illustrated in FIG. 14A1. Note that the case where separate positioninput portions 140(A), 140(B), and 140(C) are used is illustrated inFIG. 17A. The description for the case of FIG. 17A can apply to the caseof FIG. 14A2.

FIG. 14B1 is a schematic view where solid lines denote results of edgesensing processing of first positional data L-INF(1) sensed by the firstregion 140(1) of the position input portion 140 and second positionaldata L-INF(2) sensed by the second region 140(2). FIG. 14B2 is aschematic view where hatching patterns denote results of labellingprocessing of the first positional data L-INF(1) and the secondpositional data L-INF(2).

FIGS. 16A and 16B are flow charts showing the programs to be executed bythe arithmetic portion 111 of the data processing device of oneembodiment of the present invention.

<Example of Structure of Data processing Device>

The data processing device described here is the data processing device100 in Embodiment 1 in which the first region 140(1) supplies the firstpositional data L-INF(1) and the second region 140(2) supplies thesecond positional data L-INF(2) (see FIG. 14A2); and the image dataVIDEO to be displayed on the display portion 130 with which the thirdregion 140(3) overlaps is generated by the arithmetic portion 111 inaccordance with results of a comparison between the first positionaldata L-INF(1) and the second positional data L-INF(2) (see FIG. 1, FIGS.2A to 2E, FIGS. 10A1, 10A2, 10B and FIGS. 14A1, 14A2, 14B1, and 14B2).

Individual components included in the data processing device 100 aredescribed below. Note that these units can not be clearly distinguishedand one unit also serves as another unit or include part of another unitin some cases.

For example, a touch panel in which a touch sensor overlaps with adisplay portion is provided over the position input portion 140 as wellas over the display portion 130.

The data processing device 100 is different from the data processingdevice described in Embodiment 1 in that the first region of theposition input portion 140 supplies the first positional data and thesecond region of the position input portion 140 supplies the secondpositional data, and that an image to be displayed on the displayportion 130 is generated in accordance with results of a comparisonbetween the first positional data and the second positional data.Different structures will be described in detail below, and the abovedescription is referred to for the other similar structures.

<<Position Input Portion>>

The position input portion 140 is flexible to be bent such that thefirst region 140(1), the second region 140(2) facing the first region140(1), and the third region 140(3) provided between the first region140(1) and the second region 140(2) and overlapping with the displayportion 130 are formed (see FIG. 2B).

FIG. 14A1 illustrates the data processing device 100 held by a user. InFIG. 14A2, the ranges of a palm and fingers holding the data processingdevice 100 that are sensed by the proximity sensor in the position inputportion 140 are illustrated together with the position input portion 140in the unfolded state.

The first region 140(1) and the second region 140(2) of the dataprocessing device 100 held by a user sense part of the user's palm andpart of the user's fingers. For example, the first region 140(1)supplies the first positional data L-INF(1) including data on contactpositions of part of the index finger, the middle finger, and the ringfinger, and the second region 140(2) supplies the second positional dataL-INF(2) including data on a contact position of the thumb joint portion(the vicinity of the thenar). Note that the third region 140(3) suppliesdata on a contact position of the thumb.

<<Display Portion>>

The display portion 130 and the third region 140(3) overlap with eachother (see FIGS. 14A1 and 14A2). The display portion 130 is suppliedwith the image data VIDEO and displays the image data VIDEO. Forexample, the image data VIDEO including an image used for operation ofthe data processing device 100 can be displayed. A user of the dataprocessing device 100 can input positional data for selecting the image,by making his/her thumb touch the third region 140(3) overlapping withthe image.

For example, a keyboard 131, icons, and the like are displayed on theright side as illustrated in FIG. 17B when operation is performed withthe right hand. The keyboard 131, icons, and the like are displayed onthe left side as illustrated in FIG. 17C when operation is performedwith the left hand. In this way, operation with fingers is facilitated.

Note that a displayed screen may be changed in response to sensing ofinclination of the data processing device 100 by the sensor portion 150that senses acceleration. For example, the left end of the dataprocessing device 100 held in the left hand as illustrated in FIG. 18Ais positioned higher than the right end as illustrated in FIG. 18C whenseen in the direction denoted by an arrow 152. Here, in response tosensing of this inclination, a screen for the left hand is displayed asillustrated in FIG. 17C and the keyboard 131 for the left hand isoperated. In a similar manner, the right end of the data processingdevice 100 held in the right hand as illustrated in FIG. 18B ispositioned higher than the left end as illustrated in FIG. 18D when seenin the direction denoted by the arrow 152. Here, in response to sensingof this inclination, a screen for the right hand is displayed asillustrated in FIG. 17B and the keyboard 131 for the right hand isoperated. The display positions of a keyboard, icons, and the like maybe controlled in this manner.

Note that the method for sensing inclination of the data processingdevice 100 and the method illustrated in FIGS. 14A1, 14A2, 14B1, and14B2 may be combined to control the display positions. Alternatively,without sensing of information, the screen may be switched between anoperation screen for the right hand and an operation screen for the lefthand by the user of the data processing device 100.

<<Arithmetic Portion>>

The arithmetic portion 111 is supplied with the first positional dataL-INF(1) and the second positional data L-INF(2) and generates the imagedata VIDEO to be displayed on the display portion 130 in accordance withresults of a comparison between the first positional data L-INF(1) andthe second positional data L-INF(2).

<Example of Structure of Data Processing Device>

The data processing device described here is different from the dataprocessing device described in Embodiment 1 or that described above inthat the memory portion stores a program in accordance with which thearithmetic portion 111 executes the following seven steps (see FIG.16A). Different processes will be described in detail below, and theabove description is referred to for the other similar processes.

<<Example of Program>>

In a first step, the length of a first line segment is determined usingthe first positional data L-INF(1) supplied by the first region 140(1)(see 51 in FIG. 16A).

In a second step, the length of a second line segment is determinedusing the second positional data L-INF(2) supplied by the second region140(2) (see S2 in FIG. 16A).

In a third step, the length of the first line segment and the length ofthe second line segment are compared with the predetermined length. Theprogram proceeds to a fourth step when only one of the lengths of thefirst and second line segments is longer than the predetermined length.The program proceeds to the first step in other cases (see S3 in FIG.16A). Note that it is preferable that the predetermined length be longerthan or equal to 2 cm and shorter than or equal to 15 cm, and it isparticularly preferable that the predetermined length be longer than orequal to 5 cm and shorter than or equal to 10 cm.

In a fourth step, the coordinates of the midpoint of the line segmentlonger than the predetermined length are determined (see S4 in FIG.16A).

In a fifth step, whether “tap”, “flick”, or the like is performed in aregion in which the coordinates of the midpoint is not determined ischecked in the first region 140(1) or the second region 140(2) (see S5in FIG. 16A).

In a sixth step, the image data VIDEO to be displayed on the displayportion 130 which overlaps with the third region 140(3) is generatedbased on the coordinates of the midpoint and whether the operation of“tap” or “flick” has been performed confirmed in the fifth step (see S6in FIG. 16A).

In a seventh step, the program is terminated (see S7 in FIG. 16A).

The data processing device 100 described here includes the flexibleposition input portion 140 capable of sensing proximity or touch of anobject and supplying the positional data L-INF, and the arithmeticportion 111. The flexible position input portion 140 can be bent suchthat the first region 140(1), the second region 140(2) facing the firstregion 140(1), and the third region 140(3) positioned between the firstregion 140(1) and the second region 140(2) and overlapping with thedisplay portion 130 are formed. The arithmetic portion 111 can comparethe first positional data L-INF(1) supplied by the first region 140(1)with the second positional data L-INF(2) supplied by the second region140(2) and generate the image data VIDEO to be displayed on the displayportion 130.

With this structure, whether a palm or a finger is proximate to ortouches the first region 140(1) or the second region 140(2) can bedetermined, furthermore, whether the data processing device is operatedwith one hand or whether it is operated with both hands can bedetermined, and the image data VIDEO including an image (e.g., an imageused for operation) positioned for easy operation can be generated. As aresult, a human interface with high operability can be provided.Furthermore, a novel data processing device with high operability can beprovided.

Note that a step in which the display portion 130 displays thepredetermined image data VIDEO (also referred to as initial image) maybe included before the first step. In that case, the predetermined imagedata VIDEO can be displayed when both the length of the first linesegment and that of the second line segment are longer or shorter thanthe predetermined length.

Individual processes executed by the arithmetic portion with the use ofthe program are described below. Note that these processes cannot beclearly distinguished and one process also serves as another process orinclude part of another process in some cases.

<<Method for Determining Midpoint of Line Segment>>

Hereinafter, a method for determining the length of the first linesegment and the length of the second line segment using the firstpositional data L-INF(1) and the second positional data L-INF(2),respectively, is described. A method for determining the midpoint of aline segment is also described.

Specifically, an edge sensing method for determining the length of aline segment is described.

Note that although description is given of an example in which animaging element is used as the proximity sensor, a capacitor or the likemay be used as the proximity sensor.

Assume that a value acquired by an imaging pixel with coordinates (x, y)is f_((x, y)). It is preferable that a value obtained by subtracting abackground value from a value sensed by the imaging pixel be used asf_((x, y)) because noise can be removed.

<<Method for Extracting Edge (Contour)>>

Formula 1 below expresses the sum Δ_((x, y)) of differences between avalue sensed by the imaging pixel with the coordinates (x, y) and valuessensed by imaging pixels with coordinates (x−1, y), coordinates (x+1,y), coordinates (x, y−1), and coordinates (x, y+1), which are adjacentto the coordinates (x, y).

Δ_((x,y))=4·f _((x,y)) −{f _((x,y−1)) +f _((x,y+1)) +f _((x−1,y)) +f_((x+1,y))}  [Formula 1]

FIG. 14A2 shows values sensed by the imaging pixels in the first region140(1) and the second region 140(2). FIG. 14B1 shows calculation resultsof Δ_((x,y)). When Δ_((x, y)) is used in the above manner, an edge(contour) of a finger or a palm that is proximate to or touches thefirst region 140(1) and the second region 140(2) can be extracted to thefirst region 140(1) and the second region 140(2).

<<Method for Determining Length of Line Segment>>

The coordinates of intersection between the contour extracted to thefirst region 140(1) and a predetermined line segment W1 are determined,and the predetermined line segment W1 is cut at the point ofintersection to be divided into a plurality of line segments. The linesegment having the longest length among the plurality of line segmentsis the first line segment. Note that the length of the first linesegment is length L1 (see FIG. 14-B1).

The coordinates of intersection between the contour extracted to thesecond region 140(2) and a predetermined line segment W2 are determined,and the predetermined line segment W2 is cut at the point ofintersection to be divided into a plurality of line segments. The linesegment having the longest length among the plurality of line segmentsis the second line segment. Note that the length of the second linesegment is length L2.

<<Method for Determining Midpoint>>

The length of the first line segment L1 and the length of the secondline segment L2 are compared with each other, the longer one isselected, and the coordinates of a midpoint M is calculated. In thisembodiment, the length L2 is longer than the length L1; thus, thecoordinates of the midpoint M of the second line segment are determined.

<<Image Data Generated in Accordance With Coordinates of Midpoint>>

The coordinates of the midpoint M can be associated with the position ofthe thumb joint portion (the vicinity of the thenar), the movable rangeof the thumb, or the like. In this manner, image data that facilitatesoperation of the data processing device 100 can be generated inaccordance with the coordinates of the midpoint M.

For example, it is possible to generate the image data VIDEO thatincludes an image used for operation positioned in the display portion130 with which the third region 140(3) in the movable range of the thumboverlaps. Specifically, images used for operation (denoted by circles)can be positioned on a circular arc whose center is in the vicinity ofthe midpoint M (see FIG. 14A1). Among images used for operation, imagesthat are used frequently may be positioned on a circular arc and imagesthat are used less frequently may be positioned inside or outside thecircular arc. As a result, a human interface with high operability canbe provided. Furthermore, a novel data processing device with highoperability can be provided.

In the case where an operations such as “tap” or “flick” are detected inthe region in which the midpoint M is not calculated in the first region140(1) and the second region 140(2), it can be determined that a useroperates the data processing device 100 with both hands, and apredetermined processing such as the display of image data VIDEO whichis different from the above can be executed. For example, when theoperations such as “tap” or “flick” are detected in the second region140(2) at the same time as the midpoint M is calculated in the firstregion 140(1), it can be determined that a user operates the dataprocessing device 100 with both hands, and a predetermined image can bedisplayed on the display portion 130.

In the case where the operations such as “tap” or “flick” are detectedin the region in which the midpoint M is not calculated in the firstregion 140(1) and the second region 140(2), the predetermined processingmay be performed by determining that the data processing device is notoperated by both hands. For example, predetermined program execution,display or non-display of images, or turning on or off a power sourcemay be performed.

<Example of Structure of Data Processing Device>

The data processing device described here is different from the dataprocessing device described in Embodiment 1 or that described above inthat the memory portion stores a program in accordance with which thearithmetic portion 111 executes the following six steps, in which thearea of a first figure and the area of a second figure are used insteadof the length of the first line segment and the length of the secondline segment (see FIG. 16B). Different processes will be described indetail below, and the above description is referred to for the othersimilar processes.

<<Example of Program>>

In a first step, the area of the first figure is determined using thefirst positional data L-INF(1) supplied by the first region 140(1) (T1in FIG. 16B).

In a second step, the area of the second figure is determined using thesecond positional data L-INF(2) supplied by the second region 140(2) (T2in FIG. 16B).

In a third step, the area of the first figure and the area of the secondfigure are compared with the predetermined area. The program proceeds toa fourth step when only one of the areas of the first and second figuresis larger than the predetermined area. The program proceeds to the firststep in other cases (T3 in FIG. 16B). Note that it is preferable thatthe predetermined area be larger than or equal to 1 cm² and smaller thanor equal to 8 cm², and it is particularly preferable that thepredetermined area be larger than or equal to 3 cm² and smaller than orequal to 5 cm².

In a fourth step, the barycentric coordinates of the figure whose areais larger than the predetermined area are determined (T4 in FIG. 16B).

In a fifth step, whether “tap”, “flick”, or the like is performed in aregion in which barycentric coordinates are not determined in the firstregion 140(1) and the second region 140(2) is checked (see T5 in FIG.16A).

In a sixth step, the image data VIDEO to be displayed on the displayportion 130 which overlaps with the third region is generated based onthe barycentric coordinates and whether the operation of “tap” or“flick” has been performed confirmed in the fifth step (T6 in FIG. 16B).

In a seventh step, the program is terminated (see T7 in FIG. 16B).

Individual processes executed by the arithmetic portion with the use ofthe program are described below. Note that these processes cannot beclearly distinguished and one process also serves as another process orinclude part of another process in some cases.

<<Method for Determining Center of Area>>

Hereinafter, a method for determining the area of the first figure andthe area of the second figure using the first positional data L-INF(1)and the second positional data L-INF(2), respectively, is described. Amethod for determining the center of gravity of a figure is alsodescribed.

Specifically, labeling processing for determining the area of a figureis described.

Note that although description is given of an example in which animaging element is used as the proximity sensor, a capacitor or the likemay be used as the proximity sensor.

Assume that a value acquired by an imaging pixel with coordinates (x, y)is f_((x, y)). It is preferable that a value obtained by subtracting abackground value from a value sensed by the imaging pixel be used asf_((x, y)) because noise can be removed.

<<Labelling Processing>>

In the case where one imaging pixel and an adjacent imaging pixel in thefirst region 140(1) and the second region 140(2) each acquire a valuef_((x, y)) exceeding a predetermined threshold value, the region wherethe region occupied by these imaging pixels is regarded as one figure.Note that when f_((x, y)) can be 256, for example, it is preferable thatthe predetermined threshold value be greater than or equal to 0 and lessthan or equal to 150, and it is particularly preferable that thepredetermined threshold value be greater than or equal to 0 and lessthan or equal to 50.

The above processing is performed on all of the imaging pixels in thefirst region 140(1) and the second region 140(2), and imaging of theresults is carried out to give the regions in which adjacent imagingpixels each exceeds the predetermined threshold value as shown in FIGS.14A2 and 14B2. The figure having the largest area among figures in thefirst region 140(1) is the first figure. The figure having the largestarea among figures in the second region 140(2) is the second figure.

<<Method for Determining Center of Gravity of Figure>>

The area of the first figure and that of the second figure are compared,the larger one is selected, and the center of gravity is calculated.Coordinates C_((X, Y)) of the center of gravity can be calculated usingFormula (2) below.

$\begin{matrix}{C_{({X,Y})} = \left( {{\frac{1}{n}{\sum\limits_{i = 0}^{n - 1}x_{i}}},{\frac{1}{n}{\sum\limits_{i = 0}^{n - 1}y_{i}}}} \right)} & \left\lbrack {{Formula}\mspace{14mu} 2} \right\rbrack\end{matrix}$

In Equation (2), (x, y) represents the coordinates of n imaging pixelsforming one figure. The area of the second figure is larger than that ofthe first figure; thus, the barycentric coordinates C of the secondfigure are determined.

<<Image Data Generated in Accordance With Barycentric Coordinates>>

The barycentric coordinates C can be associated with the position of thethumb joint portion (the vicinity of the thenar), the movable range ofthe thumb, or the like. In this manner, image data that facilitatesoperation of the data processing device 100 can be generated inaccordance with the barycentric coordinates C.

In the case where an operations such as “tap” or “flick” are detected inthe region in which the center of gravity C is not calculated in thefirst region 140(1) and the second region 140(2), it can be determinedthat a user operates the data processing device 100 by both hands, andthe image data VIDEO which is different from above can be displayed.

In the case where an operations such as “tap” or “flick” are detected inthe region in which the center of gravity C is not calculated in thefirst region 140(1) and the second region 140(2), operations other thanthe display of the image data VIDEO may be performed. For example,execution of a predetermined program, display or non-display of imagesor turning on or off a power source may be performed.

In the case where the position input portion 140 is provided on thefront surface and the back surface of the data processing device 100,the position input portion 140 of the front surface and the back surfaceare tapped at the same time, whereby execution of the predeterminedprogram, display or non-display of images, or turning on or off a powersource may be performed, for example (see FIG. 19A). In addition,portions of the position input portion 140 of the front surface and theback surface are “flicked” at the same time, whereby execution of thepredetermined program, display or non-display of images, turning on oroff a power source may be performed, for example (see FIG. 19B).Therefore, unexpected malfunctions can be prevented.

This embodiment can be combined with any of the other embodiments inthis specification as appropriate.

Embodiment 4

In this embodiment, a structure of a data processing device of oneembodiment of the present invention will be described with reference todrawings.

FIGS. 15A and 15B illustrate a state where the data processing device100B of one embodiment of the present invention is held by a user. FIG.15A illustrates the data processing device 100B in a folded state heldby a user, and FIG. 15B illustrates the ranges of a palm and fingerssensed by the data processing device 100B in the state illustrated inFIG. 15A. Note that the ranges of the palm and fingers are illustratedtogether with the unfolded position input portion 140B.

FIG. 20 is a flow chart showing the program to be executed by thearithmetic portion 111 of the data processing device 100B of oneembodiment of the present invention.

FIGS. 21A to 21C illustrate an example of an image displayed on thedisplay portion 130 of the data processing device 100B of one embodimentof the present invention.

FIG. 22 is a flow chart showing the program to be executed by thearithmetic portion 111 of the data processing device 100B of oneembodiment of the present invention.

<Example of Structure of Data Processing Device>

In a data processing device described here, the first region 140B(1) ofthe position input portion 140B supplies the first positional dataL-INF(1), and the second region 140B(2) supplies the second positionaldata L-INF(2) (see FIG. 15B). The sensor portion 150 supplies thesensing data SENS including folding data; and the image data VIDEO to bedisplayed on the display portion 130 is generated by the arithmeticportion 111 in accordance with the sensing data SENS including thefolding data and results of a comparison between the first positionaldata L-INF(1) and the second positional data L-INF(2) (see FIG. 11,FIGS. 12A to 12C, and FIGS. 15A and 15B).

Individual components included in the data processing device 100B aredescribed below. Note that these units can not be clearly distinguishedand one unit also serves as another unit or include part of another unitin some cases.

For example, a touch panel in which a touch sensor overlaps with adisplay portion is provided in the position input portion 140B as wellas in the display portion 130.

The data processing device 100B is different from the data processingdevice described in Embodiment 2 in that the first region 140B(1) of theposition input portion 140B supplies the first positional data and thesecond region 140B(2) of the position input portion 140B supplies thesecond positional data, and that an image to be displayed on the displayportion 130 is generated in accordance with results of a comparisonbetween the first positional data and the second positional data.Different structures will be described in detail below, and the abovedescription is referred to for the other similar structures.

<<Position Input Portion>>

The position input portion 140B is flexible to unfolded or folded suchthat the first region 140B(1), the second region 140B(2) facing thefirst region 140B(1), and the third region 140B(3) provided between thefirst region 140B(1) and the second region 140B(2) and overlapping withthe display portion 130B are formed (see FIGS. 12A to 12C).

The first region 140B(1) and the second region 140B(2) which the user'spalm and the user's fingers are proximate to or touch sense part of theuser's palm and part of the user's fingers. For example, the firstregion 140B(1) supplies the first positional data L-INF(1) includingdata on contact positions of part of the index finger, the middlefinger, and the ring finger, and the second region 140B(2) supplies thesecond positional data L-INF(2) including data on a contact position ofthe thumb joint portion (the vicinity of the thenar). Note that thethird region 140B(3) supplies data on a contact position of the thumb.

<<Display Portion>>

The display portion 130 and the third region 140B(3) overlap with eachother (see FIGS. 15A and 15B). The display portion 130 is supplied withthe image data VIDEO and can display an image used for operation of thedata processing device 100B, for example. A user of the data processingdevice 100B can input positional data for selecting the image, by makinghis/her thumb touch the third region 140B(3) overlapping with the image.

<<Arithmetic Portion>>

The arithmetic portion 111 is supplied with the first positional dataL-INF(1) and the second positional data L-INF(2) and generates the imagedata VIDEO to be displayed on the display portion 130 in accordance withresults of a comparison between the first positional data L-INF(1) andthe second positional data L-INF(2).

<Example of Structure of Data Processing Device>

The data processing device described here is different from the dataprocessing device described in Embodiment 2 or that described above inthat the memory portion stores a program in accordance with which thearithmetic portion 111 executes the following nine steps (see FIG. 20).Different processes will be described in detail below, and the abovedescription is referred to for the other similar processes.

<<Example of Program>>

In a first step, the length of the first line segment is determinedusing the first positional data supplied by the first region (U1 in FIG.20).

In a second step, the length of the second line segment is determinedusing the second positional data supplied by the second region (U2 inFIG. 20).

In a third step, the length of the first line segment and the length ofthe second line segment are compared with the predetermined length. Theprogram proceeds to a fourth step when only one of the lengths of thefirst and second line segments is longer than the predetermined length.The program proceeds to the first step in other cases (U3 in FIG. 20).Note that it is preferable that the predetermined length be longer thanor equal to 2 cm and shorter than or equal to 15 cm, and it isparticularly preferable that the predetermined length be longer than orequal to 5 cm and shorter than or equal to 10 cm.

In the fourth step, the coordinates of the midpoint of the line segmentlonger than the predetermined length are determined (U4 in FIG. 20).

In a fifth step, whether or not the operation such as “tap” or “flick”is performed in a region in which the coordinates of the midpoint arenot determined in the first region 140(1) and the second region 140(2)is checked (see U5 in FIG. 20A).

In a sixth step, the folding data of the data processing device 100B isacquired. The program proceeds to a seventh step when the folding dataindicates the folded state (U6 in FIG. 20).

In the seventh step, the first image data to be displayed on the displayportion 130 with which the third region overlaps is generated inaccordance with the coordinates of the midpoint and whether theoperation of “tap” or “flick” has been performed which is confirmed inthe fifth step (U7 in FIG. 20).

In the sixth step, the folding data of the data processing device 100Bis acquired. The program proceeds to an eighth step when the foldingdata indicates the folded state (U5 in FIG. 20).

In the eighth step, the second image data to be displayed on the displayportion with which the third region overlaps is generated in accordancewith the coordinates of the midpoint and whether the operation of “tap”or “flick” has been performed which is confirmed in the fifth step (U8in FIG. 20).

In the ninth step, the program is terminated (see U9 in FIG. 20).

The data processing device 100B described here includes the flexibleposition input portion 140B capable of sensing proximity or touch of anobject and supplying the positional data L-INF; the sensor portion 150including the folding sensor 151 that can determine whether the flexibleposition input portion 140B is in a folded state or an unfolded state;and the arithmetic portion 111 (see FIG. 11). The flexible positioninput portion 140B can be bent such that the first region 140B(1), thesecond region 140B(2) facing the first region 140B(1) in the foldedstate, and the third region 140B(3) positioned between the first region140B(1) and the second region 140B(2) and overlapping with the displayportion 130 are formed. The arithmetic portion 111 can compare the firstpositional data L-INF(1) supplied by the first region 140B(1) with thesecond positional data L-INF(2) supplied by the second region 140B(2)and generate the image data VIDEO to be displayed on the display portion130 in accordance with the folded state.

With this structure, whether or not a palm or a finger is proximate toor touches the first region 140B(1) or the second region 140B(2) can bedetermined, furthermore, whether data processing device is operated withone hand or with both hands can be determined, and the image data VIDEOincluding a first image positioned for easy operation in the foldedstate of the position input portion 140B (e.g., the first image in whichan image used for operation is positioned) or a second image positionedfor easy operation in the unfolded state of the position input portion140B can be generated. As a result, a human interface with highoperability can be provided. Furthermore, a novel data processing devicewith high operability can be provided.

In the data processing device 100B described here, a step in which thepredetermined image data VIDEO is generated by the arithmetic portion111 and displayed by the display portion 130 may be included before thefirst step. In that case, the predetermined image data VIDEO can bedisplayed when both the length of the first line segment and that of thesecond line segment are longer or shorter than the predetermined lengthin the third step.

Individual processes executed by the arithmetic portion with the use ofthe program are described below. Note that these processes cannot beclearly distinguished and one process also serves as another process orinclude part of another process in some cases.

The program to be executed by the arithmetic portion 111 of the dataprocessing device 100B is different from the program to be executed bythe arithmetic portion of the data processing device in Embodiment 3 inthat in the fifth step, the process is branched in accordance with thefolded state of the position input portion 140B. Different processeswill be described in detail below, and the above description is referredto for the other similar processes.

<<Process for Generating First Image Data>>

When the acquired folding data indicates the folded state, thearithmetic portion 111 generates the first image data. For example, in amanner similar to that of the fifth step of the program to be executedby the arithmetic portion 111 of the data processing device 100 inEmbodiment 3, first image data VIDEO to be displayed on the displayportion 130 with which the third region 140B(3) in the folded stateoverlaps is generated in accordance with the coordinates of the midpointand whether the operation of “tap” or “flick” has been performed whichis confirmed in the fifth step.

The coordinates of the midpoint M can be associated with the position ofthe thumb joint portion (the vicinity of the thenar), the movable rangeof the thumb, or the like. In the case where an operation such as “tap”or “flick” is not detected in the region in which the midpoint M is notcalculated in the first region 140(1) and the second region 140(2), itcan be determined that a user operates the data processing device 100with one hand, and image data that facilitates the operation of the dataprocessing device 100B in the folded state can be generated inaccordance with the coordinates of the midpoint M.

For example, it is possible to generate the first image data VIDEO forone-hand operation that includes an image used for operation positionedin the display portion 130 with which the third region 140B(3) in themovable range of the thumb overlaps. Specifically, images used foroperation (denoted by circles) can be positioned on a circular arc whosecenter is in the vicinity of the midpoint M (see FIG. 21A). Among imagesused for operation, images that are used frequently may be positioned ona circular arc and images that are used less frequently may bepositioned inside or outside the circular arc. As a result, a humaninterface with high operability can be provided in the data processingdevice 100B in the folded state. Furthermore, a novel data processingdevice with high operability can be provided.

In the case where an operations such as “tap” or “flick” are detected inthe region in which the midpoint M is not calculated in the first region140(1) and the second region 140(2), it can be judged that the dataprocessing device 100 is operated with both hands, so that the firstimage data VIDEO for two-hand operation can be displayed. Note that thefirst image data VIDEO for one-hand operation and the first image dataVIDEO for two-hand operation can be the same.

In the case where operations such as “tap” or “flick” are detected inthe region in which midpoint M is not calculated in the first region140(1) and the second region 140(2), operations other than the displayof the imaged data VIDEO may be performed. For example, execution of thepredetermined program, display or non-display of images or turning on oroff a power source may be performed.

<<Process for Generating Second Image Data>>

When the acquired folding data indicates the unfolded state, thearithmetic portion 111 generates the second image data. For example, ina manner similar to that of the fifth step of the program to be executedby the arithmetic portion 111 of the data processing device 100 inEmbodiment 3, first image data VIDEO to be displayed on the displayportion 130 with which the third region 140B(3) in the folded stateoverlaps is generated in accordance with the coordinates of the midpointand whether the operation of “tap” or “flick” has been performed whichis confirmed in the fifth step. The coordinates of the midpoint M can beassociated with the position of the thumb joint portion (the vicinity ofthe thenar), the movable range of the thumb, or the like.

For example, it is possible to generate second image data VIDEO thatincludes an image used for operation not positioned in an area withwhich the movable range of the thumb overlaps. For example, in the casewhere an operation such as “tap” or “flick” is not detected in theregion in which midpoint M is not calculated in the first region 140(1)and the second region 140(2), it can be determined that a user operatesthe data processing device 100 with one hand, and images used foroperation (denoted by circles) can be positioned outside a circular arcwhose center is in the vicinity of the midpoint M (see FIGS. 21A to21C). The position input portion 140B may be driven such that theposition input portion 140B supplies positional data in response tosensing of an object that is proximate to or touches the circular arc ora region outside the circular arc.

The user can support the data processing device 100B by holding thecircular arc or a region inside the circular arc in the position inputportion 140B in the unfolded state with one hand. The image used foroperation and displayed outside the circular arc can be operated withthe other hand. As a result, a human interface with high operability canbe provided in the data processing device 100B in the unfolded state.Furthermore, a novel data processing device with high operability can beprovided.

In the case where an operations such as “tap” or “flick” are detected inthe region in which midpoint M is not calculated in the first region140(1) and the second region 140(2) (see FIGS. 21A and 21B), it can bejudged that the data processing device 100 is operated with both hands,so that the second image data VIDEO for two-hand operation can bedisplayed. Note that the first image data VIDEO for one-hand operationand the second image data VIDEO for two-hand operation can be the same.

In the case where the operations such as “tap” or “flick” are detectedin the region in which midpoint M is not calculated in the first region140(1) and the second region 140(2), operations other than the displayof the image data VIDEO may be performed. For example, execution of thepredetermined program, display or non-display of images or turning on oroff a power source may be performed.

<Example of Structure of Data Processing Device>

The data processing device described here is different from the dataprocessing device described in Embodiment 2 or that described above inthat the memory portion stores a program in accordance with which thearithmetic portion 111 executes the following seven steps, in which thearea of the first figure and the area of the second figure are usedinstead of the length of the first line segment and the length of thesecond line segment (see FIG. 22). Different processes will be describedin detail below, and the above description is referred to for the othersimilar processes.

<<Example of Program>>

In a first step, the area of the first figure is determined using thefirst positional data supplied by the first region 140B(1) (see V1 inFIG. 22).

In a second step, the area of the second figure is determined using thesecond positional data supplied by the second region 140B(2) (see V2 inFIG. 22).

In a third step, the area of the first figure and the area of the secondfigure are compared with the predetermined area. The program proceeds toa fourth step when only one of the area of the first figure and the areaof the second figure is larger than the predetermined area. The programproceeds to the first step in other cases (see V3 in FIG. 22). Note thatit is preferable that the predetermined area be larger than or equal to1 cm² and smaller than or equal to 8 cm², and it is particularlypreferable that the predetermined area be larger than or equal to 3 cm²and smaller than or equal to 5 cm².

In a fourth step, the barycentric coordinates of the area which islarger than the predetermined area are determined (see V4 in FIG. 22).

In a fifth step, the folding data of the data processing device 100B isacquired. The program proceeds to the sixth step when the folding dataindicates the folded state (see V5 in FIG. 22).

In a sixth step, whether operations of “tap”, “flick”, or the like areperformed in a region in which the coordinates of the midpoint are notdetermined in the first region 140(1) and the second region 140(2) ischecked (see V6 in FIG. 22).

In a seventh step, the first image data to be displayed on the displayportion 130 which overlaps with the third region is generated inaccordance with the barycentric coordinates and whether the operation of“tap” or “flick” has been performed confirmed in the sixth step (see V7in FIG. 22).

In a fifth step, the folding data of the data processing device 100B isacquired. The program proceeds to the eighth step when the folding dataindicates the folded state (see V5 in FIG. 22).

In an eighth step, the second image data to be displayed on the displayportion with which the third region overlaps is generated in accordancewith the barycentric coordinates (see V8 in FIG. 22).

The program is terminated in a ninth step (see V9 in FIG. 22).

This embodiment can be combined with any of the other embodiments inthis specification as appropriate.

Embodiment 5

In this embodiment, an operation example that can be used for the dataprocessing device of one embodiment of the present invention will bedescribed with reference to drawings.

In the case where the data processing device 100 is held by a user, aspecific region of the position input portion 140 is touched for a longtime. In the display portion 130, display on a region overlapping withthe region touched or rewriting data in the region overlapping with theregion touched is not performed, whereby power consumption of the dataprocessing device 100 can be suppressed. Since a region touched is ablind spot, visibility of the display image is not decreased when thedisplay in the region overlapping with the region touched is stopped.Here, the region in which the display is stopped may be smaller than theregion touched, for example. In that case, display appears to beperformed even if a hand holding the data processing device moves alittle.

In the display portion 130, there may be a region in which display isnot performed or a region in which a rewriting operation is notperformed may be provided in a region other than touched region. Forexample, when the data processing device 100 is held by a user, theremight be a region in which a user cannot view the display images nearthe region touched even though the region is not touched. A region inwhich display is not performed or a region in which a rewritingoperation is not performed may be provided even in such a region.

As an example of such a case, the case of contacting the display portion130 with a palm can be given. When a palm contacts the display portion130, the entire palm does not necessary contact the display portion.Even in a region with which palm is not in contact, however, the palmprevents a user from viewing the region in some cases. Thus, display ora rewriting operation is not necessarily performed in such a region.

Here, the terms “display is not performed” and “rewriting operation isnot performed” refer to not supplying a new image signal or charge topixels in the display portion 130. Furthermore, the terms indicate thatlight is not supplied from the lighting device such as a backlight or afrontlight. For example, in the case of using a light-emitting elementfor the pixel, black display is performed in the region that is notsupplied with an image signal in some cases. In addition, in the casewhere a display element that is not a light emitting element (e.g., aliquid crystal element) is used for the pixel, black display or whitedisplay is performed depending on a pixel configuration. Moreover, inthe case of using a liquid crystal element as the pixel, an image whichis displayed just before the supply of an image signal is stopped mightbe continuously displayed. For example, in the case of using atransistor including an oxide semiconductor in a channel portion, thesame image may be continuously displayed because the off-state currentof the transistor is extremely small. Furthermore, in the case of usinga liquid crystal element for the pixel, black display may be performedin the region to which illumination light from the backlight is notsupplied.

In the case where a user holds the data processing device 100 with ahand and the like, the region held by the hand can be determined byvarious methods.

For example, as described in the above embodiments, the edge detectionprocessing is performed based on the first positional data L-INF (1)sensed by the first region 140(1) of the position input portion 140 anda second positional data L-INF (2) sensed by a second region 140(2), andwhen the arithmetic portion 111 determines that the area or thebarycentric coordinates of the region surrounded by the edge is notchanged for a certain period or longer, a portion of the display of thedisplay portion 130 overlapping with the region is stopped.Alternatively, the display image rewriting of a portion of the displayportion 130 that overlaps with the region is stopped. A similarprocessing may be performed using a third positional data L-INF (3)sensed by the third region 140(3). In the case where the data processingdevice 100 includes a fourth region 140(4) and a fifth region 140(5),for example, a similar processing may be performed based on fourthpositional data L-INF (4) sensed by the fourth region 140(4) and a fifthpositional data L-INF (5) sensed by the fifth region 140(5), forexample.

Alternatively, all the touched regions are simply detected, and theregions which are determined to be touched for a certain period orlonger may be determined to be a region which is held by a hand or thelike. Alternatively, the regions may be determined by using anothersensor such as an acceleration sensor, an optical sensor, and aninfrared ray sensor. In such a manner, the regions that are held by ahand can be determined by using and combining various methods.

For example, as shown in FIG. 32(A), a region A which is touched for acertain period or longer by a hand or the like does not react. Inaddition, a region B does not react because the region B is not incontact with anything. Next, as shown in FIG. 32(B), when a finger orthe like touches the region B, the region B reacts but the region A doesnot react. It is possible to operate the data processing device 100 bysuch a method.

<<Example of Program>>

An example of a program for making the arithmetic portion 111 executethe processing by which display is not performed in the regionoverlapping with the region touched for a certain period will bedescribed with reference to FIG. 23. The data processing devicedescribed here has a memory portion storing a program for making thearithmetic portion 111 execute the following eight steps. Note that thedata processing device described in the above embodiments can beappropriately used as the data processing device.

In a first step, a region a1 that is touched over the position inputportion 140 is identified based on the first positional data L-INF (1)to the fourth positional data L-INF (4), and the like (see R1 in FIG.23).

In a second step, the area and the barycentric coordinates of the regiona1 are calculated (R2 in FIG. 23).

In a third step, the data processing device stands by for a certainperiod (R3 in FIG. 23). Note that the stand-by time is preferably 1second or longer and shorter than 30 seconds, and more preferably 1second or longer and shorter than 15 seconds. When the stand-by time istoo long, the display quality of the data processing device 100 islikely to decrease because the display in the display portion 130overlapping with the region a1 might not be performed even after theholding position changed or holding is stopped.

In a fourth step, a region a2 over the position input portion 140 whichis touched is identified based on the first positional data L-INF (1) tothe fourth positional data L-INF (4), or the like (R4 in FIG. 23).

In a fifth step, the area and the barycentric coordinates of the regiona2 are calculated (R5 in FIG. 23).

In a sixth step, whether there are big differences in the areas and thebarycentric coordinates between the region a1 and the region a2 isdetermined (R6 in FIG. 23).

In the case where there is no great difference in at least one of theareas and the barycentric coordinates between the region a1 and theregion a2, a seventh step is performed (R7 in FIG. 23).

In the seventh step, display of the display portion 130 overlapping withthe region a1 is stopped. Alternatively, display image rewriting of thedisplay portion 130 overlapping with the region a1 is stopped. Afterthat, the operation returns to the third step, and the data processingdevice stands by for a certain period.

In the sixth step, in the case where there is a great difference in atleast one of the areas and the barycentric coordinates between theregion a1 and the region a2, the execution of the program is terminatedin an eighth step.

In such a manner, power consumption of the data processing device 100can be suppressed.

Note that although the display or the display image rewriting of thedisplay portion 130 overlapping with the region a1 is stopped in theseventh step, one embodiment of the present invention is not limitedthereto. For example, in the seventh step, when the display or thedisplay image rewriting of the display portion 130 is stopped, it isalso stopped not only in the region touched for a certain period butalso in the vicinity thereof. Alternatively, the display or the displayimage rewriting of the display portion 130 is stopped in a region whichis a slightly smaller than the region touched for a certain period.

In the case of FIGS. 2C, 2D, and 2E, for example, when the regiontouched for a certain period exists in any part of the fourth region140(4), the display of a region of the display portion 130 that overlapswith the entire part of the first region 140(4) is stopped, or thedisplay image rewriting is stopped. Similarly, for example, in the casewhere a region touched for a certain period exists in any part of thefirst region 140(1), the display of a region of the display portion 130that overlaps with the entire part of the first region 140(1) isstopped, or the display image rewriting is stopped. For example, sincethe fourth region 140(4) corresponds to the back surface of the dataprocessing device 100, the fourth region 140(4) is a place which ishardly viewed by a user when the data processing device is held.Accordingly, when the display portion 130 may be not viewed from a user,the display or the display image rewriting is temporarily stopped in theentire part of such a region. However, when the third region 140(3) isnot touched for a certain period, the display is restored, for example.Thus, the display can be performed only when a user is viewing, whichresults in reducing the power consumption.

In the case where a user views the fourth region 140(4), the thirdregion 140(3) substantially corresponds to the back surface of the dataprocessing device 100. Thus, for example, in such a case, in a mannersimilar to the case of the fourth region 140(4), the display or thedisplay image rewriting of the display portion 130 is stopped in theentire part of the third region 140(3).

At least one of the region determining whether the region is touched fora long time; the region determining whether the region is touched forholding the data processing device by a user; the region in which thedisplay of the display portion 130 is stopped; and the region in whichthe display image rewriting of the display portion 130 may be set to bea part of a region of the display portion 130. Furthermore, the positionof the region, a judgment operation or a display operation performed inthe region, and the like may be changed according to the situation. Inaddition, they may be set and changed by a user.

For example, whether a region is touched for a long time or is touchedfor holding the device is not necessarily determined in the regioncorresponding to the front surface of the data processing device 100,such as in the third region 140(3). Furthermore, in such a region, thedisplay or the display image rewriting of the display portion 130 is notnecessarily stopped. In this manner, a user can view a display imageeven when the user rapidly changes the holding state of the dataprocessing device 100.

Furthermore, an acceleration sensor, a magnetic sensor, or the like maybe used for determining whether a user is viewing the back surface orthe front surface of the data processing device 100. By utilizing dataof these sensors, circumstances can be precisely judged.

In the case where the data processing device 100 is held by a user, whenthe region held by a user is included in the region determining touchaction, touch action cannot be accurately determined, which causesmalfunction or decrease in operability. In addition, there is a risk ofdropping the data processing device 100 when a user holds a region ofthe data processing device 100 except for the region determining touchaction.

Hence, for example, a region touched by a user unintentionally isexcluded from the region determining touch action in the position inputportion 140. Furthermore, for example, a region of the position inputportion 140 touched by a user for holding the data processing device 100is excluded from the region determining touch action. Alternatively, forexample, a region which cannot be touched even if a user intends to isexcluded from the region determining touch action. For example, a regiontouched for a certain period is excluded from a region determining touchaction in the position input portion 140. Thus, detection accuracy oftouch action can be improved. Furthermore, favorable operability of thedata processing device 100 can be obtained.

As an example of a region which cannot be touched even if a user intendsto, a region in contact with a palm can be given. In the case where apalm touches the region, the entire palm is not necessarily in contactwith the region. Even if the region is not touched by a palm, the palmprevents the other hand from touching the region.

As an example of a region which cannot be touched even if a user intendsto touch, small spaces between fingers at the time of touching with aplurality of fingers can be given. The spaces cannot be touched withanother hand. In this manner, a region which cannot be touched even if auser intends to touch may be excluded from the region determining touchaction.

In the case where the data processing device 100 is held by a hand orthe like, the region held by a hand can be judged by various methods.

For example, as described in the above embodiments, the edge detectionprocess is performed based on the first positional data L-INF (1) sensedby the first region 140(1) of the position input portion 140 and thesecond positional data L-INF (2) sensed by the second region 140(2), andwhen the arithmetic portion 111 judges that the area or the barycentriccoordinates of a region surrounded by the edge is not changed for acertain period or longer, the region is excluded from the regiondetermining touch action. The similar processing may be performed usingthe third positional data L-INF (3) sensed by the third region 140(3).In the case where the data processing device 100 includes the fourthregion 140(4), the fifth region 140(5), and the like, the sameprocessing may be performed based on the results of the fourthpositional data L-INF (4) sensed by the fourth region 140(4) and thefifth positional data L-INF (5) sensed by the fifth region 140(5), andthe like.

Alternatively, all the touched regions are simply detected, and theregion which is determined to be touched for a certain period or longermay be determined to be a region which is held by a hand, or the like.Alternatively, the regions may be determined by using another sensorsuch as an acceleration sensor, an optical sensor, and an infrared raysensor. In such a manner, the regions that are held with a hand can bedetermined by using and combining various methods.

<<Example of Program>>

An example of a program for making the arithmetic portion 111 executethe processing by which a region touched for a certain period isexcluded from the region determining touch action will be described withreference to FIG. 24. The data-processing device described here has thememory portion storing a program for making the arithmetic portion 111execute the following eight steps. Note that, the data processing devicedescribed in the above embodiments can be appropriately used as the dataprocessing device.

In a first step, a region a1 that is touched over the position inputportion 140 is identified based on the first positional data L-INF (1)to the fourth positional data L-INF (4), and the like (see W1 in FIG.24).

In a second step, the area and the barycentric coordinates of the regiona1 are calculated (see W2 in FIG. 24).

In a third step, the data processing device stands by for a certainperiod (see W3 in FIG. 24). The stand by time is preferably 1 second orlonger and shorter than 30 seconds, and more preferably 1 second orlonger and shorter than 15 seconds. When the stand-by time is too long,display quality of the data processing device 100 is likely to decreasebecause the display in the display portion 130 that overlaps with aregion a1 is not performed in some cases even after the holding positionchanged or holding is stopped.

In a fourth step, a region a2 that is touched over the position inputportion 140 is identified based on the first positional data L-INF (1)to the fourth positional data L-INF (4), and the like (see W4 in FIG.24).

In a fifth step, the area and the barycentric coordinates of a region a2are calculated (see W5 in FIG. 24).

In a sixth step, whether there are big differences in the area and thebarycentric coordinates between region a1 and the region a2 is judged(see W6 in FIG. 24).

In the case where there is no great difference in at least one of theareas and the barycentric coordinates between the region a1 and theregion a2, a seventh step is performed (see W7 in FIG. 24).

In the seventh step, a region touched for a certain period is excludedfrom the region determining the touching action in the position inputportion 140.

In the sixth step, in the case where there is a great difference in atleast one of the areas and the barycentric coordinates of the region a1and the region a2, the execution of the program is terminated in aneighth step.

In such a manner, detection accuracy of touch action of the dataprocessing device 100 can be improved. Furthermore, favorableoperability of the data processing device 100 can be obtained. Since auser does not need to be careful not to touch the region determiningtouch action, the data processing device 100 can be easily held. Sinceit becomes easy for a user to operate the data processing device 100 byone hand while holding the data processing device 100 by the other hand,the user can easily operate the data processing device 100 by bothhands.

Note that, although the region touched for a certain period is excludedfrom the region determining the touching action in the position inputportion 140 in the seventh step, one embodiment of the present inventionis not limited thereto. For example, in the seventh step, when theregion touched for a certain period is excluded from the regiondetermining the touch action in the position input portion 140, thevicinity of the region touched for a certain period can also be excludedfrom the region determining touch action.

In the case of FIGS. 2A and 2B, for example, when a region touched for acertain period exists in any part of the second region 140(2), theentire part of the second region 140(2) is excluded from the regiondetermining touch action. Similarly, for example, when a region touchedfor a certain period exists in any part of the first region 140(1), theentire part of the first region 140(1) is excluded from the regiondetermining touch action. Since the first region 140(1) and the secondregion 140(2) correspond to the side surfaces of the data processingdevice 100, the first region 140(1) and the second region 140(2) areregions that are easily touched. Thus, such regions may be temporarilyexcluded from the regions determining touch action. Note that, when thefirst region 140(1) and the second region 140(2) are not touched for acertain period, the regions are returned to the regions determiningtouch action. Accordingly, touch action can be utilized only when a userintends to perform operations.

At least one of the region determining whether the region is touched fora long time, the region determining whether the region is touched by auser for holding the data processing device, and the region determiningtouch action may be set to be a part of the region of the displayportion 130. Furthermore, the position of the region, a judgmentoperation or a display operation performed in the region, and the likemay be changed according to the situation. In addition, they may be setand changed by a user.

For example, whether a region is touched for a long time or is touchedfor holding the data processing device is not necessarily judged in theregion corresponding to the front surface of the data processing device100 such as the third region 140(3). In addition, such a region is notnecessarily excluded from the region determining touch action. Thus, auser can use the data processing device 100 smoothly in some cases.

Note that instead of determining whether a region is touched for acertain period, a user may set a specific region which is excluded fromthe region determining touch action. For example, in a normal use, onlya front surface such as the third region 140(3) may be set to be theregion determining touch action. Then, the other regions are excludedfrom the region determining touch action. The settings are changedaccording the usage of the data processing device. Thus, a user caneasily operate the data processing device 100.

Furthermore, an acceleration sensor, a magnetic sensor, or the like canbe used for determining whether a user is viewing the back surface orthe front surface of the data processing device 100. By utilizing thedata of these sensors, circumstances can be precisely determined.

The program described above is not only used in the data processingdevice 100 but also used in data processing devices in otherembodiments. In FIG. 25, a data processing device 100B which is unfoldedis held by a left hand, and touch action is performed on the positioninput portion 140 overlapping with the display portion 130 by a righthand. With the use of the program described above in the data processingdevice 100B, the display of the region held by a left hand is stopped,which results in reducing the power consumption. Alternatively, with useof the program described above in the data processing device 100B, theregion held by a left hand is excluded from the region determining touchaction, whereby the detection accuracy of touch action of the dataprocessing device 100B can be improved. Alternatively, favorableoperability of the data processing device 100B can be obtained.

When the data processing device 100 is held by a user, in a region ofthe display portion 130 overlapping with the region touched, anoperation of not performing the display of the region or an operation ofnot performing rewriting operation of the region, and an operation ofexcluding the region from the region determining touch action can becarried out in combination. For example, display is not performed andtouch action is not judged in the region touched by a user for holdingthe data processing device 100.

This embodiment can be combined with any of the other embodiments inthis specification as appropriate.

Embodiment 6

In this embodiment, the structure of a display panel that can be usedfor a position input portion and a display device of the data processingdevice of one embodiment of the present invention will be described withreference to FIGS. 26A to 26C. Note that the display panel described inthis embodiment includes a touch sensor (a contact sensor device) thatoverlaps with a display portion; thus, the display panel can be called atouch panel (an input/output device).

FIG. 26A is a top view illustrating the structure of a display panelthat can be used for a position input portion and a display device ofthe data processing device of one embodiment of the present invention.

FIG. 26B is a cross-sectional view taken along line A-B and line C-D inFIG. 26A.

FIG. 26C is a cross-sectional view taken along line E-F in FIG. 26A.

<Top View>

An input/output device 300 described as an example in this embodimentincludes a display portion 301 (see FIG. 26A).

The display portion 301 includes a plurality of pixels 302 and aplurality of imaging pixels 308. The imaging pixels 308 can sense atouch of a finger or the like on the display portion 301. Thus, a touchsensor can be formed using the imaging pixels 308.

Each of the pixels 302 includes a plurality of sub-pixels (e.g., asub-pixel 302R). In addition, in the sub-pixels, light-emitting elementsand pixel circuits that can supply electric power for driving thelight-emitting elements are provided.

The pixel circuits are electrically connected to wirings through whichselection signals are supplied and wirings through which image signalsare supplied.

Furthermore, the input/output device 300 is provided with a scan linedriver circuit 303 g(1) that can supply selection signals to the pixels302 and an image signal line driver circuit 303 s(1) that can supplyimage signals to the pixels 302. Note that when the image signal linedriver circuit 303 s(1) is placed in a portion other than a bendableportion, malfunction can be inhibited.

The imaging pixels 308 include photoelectric conversion elements andimaging pixel circuits that drive the photoelectric conversion elements.

The imaging pixel circuits are electrically connected to wirings throughwhich control signals are supplied and wirings through which powersupply potentials are supplied.

Examples of the control signals include a signal for selecting animaging pixel circuit from which a recorded imaging signal is read, asignal for initializing an imaging pixel circuit, and a signal fordetermining the time it takes for an imaging pixel circuit to detectlight.

The input/output device 300 is provided with an imaging pixel drivercircuit 303 g(2) that can supply control signals to the imaging pixels308 and an imaging signal line driver circuit 303 s(2) that reads outimaging signals. Note that when the imaging signal line driver circuit303 s(2) is placed in a portion other than a bendable portion,malfunction can be inhibited.

<Cross-Sectional View>

The input/output device 300 includes a substrate 310 and a countersubstrate 370 that faces the substrate 310 (see FIG. 26B).

The substrate 310 is a stacked body in which a flexible substrate 310 b,a barrier film 310 a that prevents diffusion of unintentional impuritiesto the light-emitting elements, and an adhesive layer 310 c thatattaches the barrier film 310 a to the substrate 310 b are stacked.

The counter substrate 370 is a stacked body including a flexiblesubstrate 370 b, a barrier film 370 a that prevents diffusion ofunintentional impurities to the light-emitting elements, and an adhesivelayer 370 c that attaches the barrier film 370 a to the substrate 370 b(see FIG. 26B).

A sealant 360 attaches the counter substrate 370 to the substrate 310.The sealant 360 also serving as an optical adhesive layer has arefractive index higher than that of air. The pixel circuits and thelight-emitting elements (e.g., a first light-emitting element 350R) andthe imaging pixel circuits and photoelectric conversion elements (e.g.,a photoelectric conversion element 308 p) are provided between thesubstrate 310 and the counter substrate 370.

<<Structure of Pixel>>

Each of the pixels 302 includes a sub-pixel 302R, a sub-pixel 302G, anda sub-pixel 302B (see FIG. 26C). The sub-pixel 302R includes alight-emitting module 380R, the sub-pixel 302G includes a light-emittingmodule 380G, and the sub-pixel 302B includes a light-emitting module380B.

For example, the sub-pixel 302R includes the first light-emittingelement 350R and the pixel circuit that can supply electric power to thefirst light-emitting element 350R and includes a transistor 302 t (seeFIG. 26B). Furthermore, the light-emitting module 380R includes thefirst light-emitting element 350R and an optical element (e.g., acoloring layer 367R).

The transistor 302 t includes a semiconductor layer. As thesemiconductor layer, any layer which is semiconductive can be used. Forexample, a semiconductor such as silicon and germanium, a compoundsemiconductor such as gallium arsenide, an oxide semiconductor such asindium oxide, zinc oxide, indium gallium zinc oxide, and an organicsemiconductor can be used. Furthermore, the semiconductor layer may havecrystallinity such as a single crystal, a polycrystal, a microcrystal,and the like. Furthermore, the semiconductor layer may be amorphous. Thecharacteristics of the oxide semiconductor are less likely to changeeven when a change in shape such as bending is given to the oxidesemiconductor. Thus, an oxide semiconductor is preferably used for asemiconductor layer of a transistor to be formed over a flexiblesubstrate.

Although a channel-etched transistor that is a type of bottom-gatetransistor is illustrated as the transistor 302 t in this embodiment, achannel-protective transistor can be used. In addition, the transistor302 t may be a top-gate transistor.

The transistor 302 t may have a single gate structure including onechannel formation region in a semiconductor layer, a double gatestructure including two channel formation regions in a semiconductorlayer, or a triple gate structure including three channel formationregions in a semiconductor layer.

The transistor 302 t may include a back gate electrode, with which thethreshold value of the transistor 302 t may be controlled.

The light-emitting element 350R includes a first lower electrode 351R,an upper electrode 352, and a layer 353 containing a light-emittingorganic compound between the first lower electrode 351R and the upperelectrode 352 (see FIG. 26C).

The layer 353 containing a light-emitting organic compound includes alight-emitting unit 353 a, a light-emitting unit 353 b, and anintermediate layer 354 between the light-emitting units 353 a and 353 b.

The light-emitting module 380R includes the first coloring layer 367R onthe counter substrate 370. The coloring layer transmits light of aparticular wavelength and is, for example, a layer that selectivelytransmits light of red, green, or blue color. A region that transmitslight emitted from the light-emitting element as it is may be providedas well.

The light-emitting module 380R, for example, includes the sealant 360that is in contact with the first light-emitting element 350R and thefirst coloring layer 367R.

The first coloring layer 367R is positioned in a region overlapping withthe first light-emitting element 350R. Accordingly, part of lightemitted from the first light-emitting element 350R passes through thesealant 360 that also serves as an optical adhesive layer and throughthe first coloring layer 367R and is emitted to the outside of thelight-emitting module 380R as indicated by arrows in FIGS. 26B and 26C.

<<Structure of Input/Output Unit>>

The input/output device 300 includes a light-blocking layer 367BM on thecounter substrate 370. The light-blocking layer 367BM is provided so asto surround the coloring layer (e.g., the first coloring layer 367R).

The input/output device 300 includes an anti-reflective layer 367 ppositioned in a region overlapping with the display portion 301. As theanti-reflective layer 367 p, a circular polarizing plate can be used,for example.

The input/output device 300 includes an insulating film 321. Theinsulating film 321 covers the transistor 302 t. Note that theinsulating film 321 can be used as a layer for planarizing unevennesscaused by the pixel circuits. An insulating film on which a layer thatcan prevent diffusion of impurities to the transistor 302 t and the likeis stacked can be used as the insulating film 321.

The input/output device 300 includes the light-emitting elements (e.g.,the first light-emitting element 350R) over the insulating film 321.

The input/output unit 300 includes, over the insulating film 321, apartition wall 328 that overlaps with an end portion of the first lowerelectrode 351R (see FIG. 26C). In addition, a spacer 329 that controlsthe distance between the substrate 310 and the counter substrate 370 isprovided on the partition wall 328.

<<Structure of Image Signal Line Driver Circuit>>

The image signal line driver circuit 303 s(1) includes a transistor 303t and a capacitor 303 c. Note that the image signal line driver circuit303 s(1) can be formed in the same process and over the same substrateas those of the pixel circuits. The transistor 303 t has a structuresimilar to that of the transistor 302 t. Note that the transistor 303 tmay have a structure different from that of the transistor 302 t.

<<Structure of Imaging Pixel>>

The imaging pixels 308 each include a photoelectric conversion element308 p and an imaging pixel circuit for sensing light received by thephotoelectric conversion element 308 p. The imaging pixel circuitincludes a transistor 308 t. The transistor 308 t has a structuresimilar to that of the transistor 302 t. Note that the transistor 308 tmay have a structure different from that of the transistor 302 t.

For example, a PIN photodiode can be used as the photoelectricconversion element 308 p.

<<Other Structures>>

The input/output device 300 includes a wiring 311 through which a signalcan be supplied. The wiring 311 is provided with a terminal 319. Notethat an FPC 309(1) through which a signal such as an image signal or asynchronization signal can be supplied is electrically connected to theterminal 319. The FPC 309(1) is preferably placed in a portion otherthan a bendable portion of the input/output unit 300. Moreover, the FPC309(1) is preferably placed at almost the center of one side of a regionsurrounding the display portion 301, especially a side which is folded(a longer side in FIG. 26A). Accordingly, the distance between anexternal circuit for driving the input/output unit 300 and theinput/output unit 300 can be made short, resulting in easy connection.Furthermore, the center of gravity of the external circuit can be madealmost the same as that of the input/output unit 300. As a result, thedata processing device can be treated easily and mistakes such asdropping can be prevented.

Note that a printed wiring board (PWB) may be attached to the FPC309(1).

Note that although the case where the light-emitting element is used asa display element is illustrated, one embodiment of the presentinvention is not limited thereto.

For example, in this specification and the like, a display element, adisplay device which is a device including a display element, alight-emitting element, and a light-emitting device which is a deviceincluding a light-emitting element can employ a variety of modes or caninclude a variety of elements. Examples of a display element, a displaydevice, a light-emitting element, or a light-emitting device include adisplay medium whose contrast, luminance, reflectance, transmittance, orthe like is changed by electromagnetic action, such as anelectroluminescence (EL) element (e.g., an EL element including organicand inorganic materials, an organic EL element, or an inorganic ELelement), an LED (e.g., a white LED, a red LED, a green LED, or a blueLED), a transistor (a transistor that emits light depending on current),an electron emitter, a liquid crystal element, electronic ink, anelectrophoretic element, a grating light valve (GLV), a plasma displaypanel (PDP), a display element using micro electro mechanical system(MEMS), a digital micromirror device (DMD), a digital micro shutter(DMS), MIRASOL (registered trademark), an interferometric modulatordisplay (IMOD) element, a MEMS shutter display element, anoptical-interference-type MEMS display element, an electrowettingelement, a piezoelectric ceramic display, or a carbon nanotube. Notethat examples of display devices having EL elements include an ELdisplay. Examples of display devices including electron emitters are afield emission display (FED) and an SED-type flat panel display (SED:surface-conduction electron-emitter display). Examples of displaydevices including liquid crystal elements include a liquid crystaldisplay (e.g., a transmissive liquid crystal display, a transflectiveliquid crystal display, a reflective liquid crystal display, adirect-view liquid crystal display, or a projection liquid crystaldisplay). An example of a display device including electronic ink orelectrophoretic elements is electronic paper. In the case of atransflective liquid crystal display or a reflective liquid crystaldisplay, some of or all of pixel electrodes function as reflectiveelectrodes. For example, some or all of pixel electrodes are formed tocontain aluminum, silver, or the like. In such a case, a memory circuitsuch as an SRAM can be provided under the reflective electrodes.Accordingly, power consumption can be further reduced.

In this specification and the like, for example, transistors with avariety of structures can be used as a transistor, without limitation toa certain type. For example, a transistor including a single-crystalsilicon, or a transistor including a non-single-crystal semiconductorfilm typified by amorphous silicon, polycrystalline silicon,microcrystalline (also referred to as microcrystal, nanocrystal, orsemi-amorphous) silicon, or the like can be used as a transistor. A thinfilm transistor (TFT) obtained by thinning such a semiconductor can beused. In the case of using the TFT, there are various advantages. Forexample, since the TFT can be formed at temperature lower than that ofthe case of using single-crystal silicon, manufacturing cost can bereduced or a manufacturing apparatus can be made larger. Since themanufacturing apparatus is made larger, the TFT can be formed using alarge substrate. Therefore, many display devices can be formed at thesame time at low cost. In addition, a substrate having low heatresistance can be used because of low manufacturing temperature.Therefore, the transistor can be formed using a light-transmittingsubstrate. Alternatively, transmission of light in a display element canbe controlled by using the transistor formed using thelight-transmitting substrate. Alternatively, part of a film included inthe transistor can transmit light because the thickness of thetransistor is small. Therefore, the aperture ratio can be improved.

Note that when a catalyst (e.g., nickel) is used in the case of formingpolycrystalline silicon, crystallinity can be further improved and atransistor having excellent electric characteristics can be formed.Accordingly, a gate driver circuit (e.g., a scan line driver circuit), asource driver circuit (e.g., a signal line driver circuit), and a signalprocessing circuit (e.g., a signal generation circuit, a gammacorrection circuit, or a DA converter circuit) can be formed using thesame substrate as a pixel portion.

Note that when a catalyst (e.g., nickel) is used in the case of formingmicrocrystalline silicon, crystallinity can be further improved and atransistor having excellent electric characteristics can be formed. Inthis case, crystallinity can be improved by just performing heattreatment without performing laser irradiation. Accordingly, a gatedriver circuit (e.g., a scan line driver circuit) and part of a sourcedriver circuit (e.g., an analog switch) can be formed over the samesubstrate. Note that when laser irradiation for crystallization is notperformed, unevenness in crystallinity of silicon can be suppressed.Therefore, high-quality images can be displayed. Note that it ispossible to manufacture polycrystalline silicon or microcrystallinesilicon without a catalyst (e.g., nickel).

Note that although preferably, crystallinity of silicon is improved topolycrystal, microcrystal, or the like in the whole panel, the presentinvention is not limited to this. Crystallinity of silicon may beimproved only in part of the panel. Selective increase in crystallinitycan be achieved by selective laser irradiation or the like. For example,only a peripheral driver circuit region excluding pixels may beirradiated with laser light. Alternatively, only a region of a gatedriver circuit, a source driver circuit, or the like may be irradiatedwith laser light. Alternatively, only part of a source driver circuit(e.g., an analog switch) may be irradiated with laser light.Accordingly, crystallinity of silicon can be improved only in a regionin which a circuit needs to be operated at high speed. Since a pixelregion is not particularly needed to be operated at high speed, even ifcrystallinity is not improved, the pixel circuit can be operated withoutproblems. Thus, a region whose crystallinity is improved is small, sothat manufacturing steps can be decreased. Thus, throughput can beincreased and manufacturing cost can be reduced. Alternatively, sincethe number of necessary manufacturing apparatus is small, manufacturingcost can be reduced.

Note that for example, a transistor including a compound semiconductor(e.g., SiGe, GaAs, and the like), an oxide semiconductor (e.g., ZnO,InGaZnO, IZO (indium zinc oxide) (registered trademark), ITO (indium tinoxide), SnO, TiO, and AlZnSnO (AZTO)), ITZO (In—Sn—Zn—O) (registeredtrademark),or the like; a thin film transistor obtained by thinning sucha compound semiconductor or an oxide semiconductor; or the like can beused as a transistor. A thin film transistor obtained by thinning such acompound semiconductor or an oxide semiconductor, or the like can beused. Since manufacturing temperature can be lowered, such a transistorcan be formed at room temperature, for example. Accordingly, thetransistor can be formed directly on a substrate having low heatresistance, such as a plastic substrate or a film substrate. Note thatsuch a compound semiconductor or an oxide semiconductor can be used notonly for a channel portion of the transistor but also for otherapplications. For example, such a compound semiconductor or an oxidesemiconductor can be used for a wiring, a resistor, a pixel electrode, alight-transmitting electrode, or the like. Since such an element can beformed at the same time as the transistor, cost can be reduced.

Note that for example, a transistor or the like formed by an inkjetmethod or a printing method can be used as a transistor. Accordingly, atransistor can be formed at room temperature, can be formed at a lowvacuum, or can be formed using a large substrate. Therefore, thetransistor can be formed without use of a mask (reticle), so that thelayout of the transistor can be easily changed. Alternatively, since thetransistor can be formed without use of a resist, material cost isreduced and the number of steps can be reduced. Further, since a filmcan be formed where needed, a material is not wasted as compared to amanufacturing method by which etching is performed after the film isformed over the entire surface; thus, costs can be reduced.

Note that for example, a transistor or the like including an organicsemiconductor or a carbon nanotube can be used as a transistor.Accordingly, such a transistor can be formed using a substrate which canbe bent. A device including a transistor which includes an organicsemiconductor or a carbon nanotube can resist a shock.

Note that transistors with a variety of different structures can be usedas a transistor. For example, a MOS transistor, a junction transistor, abipolar transistor, or the like can be used as a transistor. By using aMOS transistor as a transistor, the size of the transistor can bereduced. Thus, a large number of transistors can be mounted. With use ofa bipolar transistor as the transistor, large current can flow. Thus, acircuit can be operated at high speed. Note that a MOS transistor and abipolar transistor may be formed over one substrate. Thus, reduction inpower consumption, reduction in size, high speed operation, and the likecan be realized.

Note that in this specification and the like, for example, a transistorwith a multi-gate structure having two or more gate electrodes can beused as a transistor. With the multi-gate structure, a structure where aplurality of transistors are connected in series is provided becausechannel regions are connected in series. Thus, with the multi-gatestructure, the amount of off-state current can be reduced and thewithstand voltage of the transistor can be increased (the reliabilitycan be improved). Alternatively, with the multi-gate structure,drain-source current does not change much even if drain-source voltagechanges when the transistor operates in a saturation region, so that aflat slope of voltage-current characteristics can be obtained. Byutilizing the flat slope of the voltage-current characteristics, anideal current source circuit or an active load having an extremely largeresistance can be realized. Accordingly, a differential circuit, acurrent mirror circuit, or the like having excellent properties can berealized.

Note that a transistor with a structure where gate electrodes are formedabove and below a channel can be used, for example. With the structurewhere the gate electrodes are formed above and below the channel, acircuit structure where a plurality of transistors are connected inparallel is provided. Thus, a channel region is increased, so that theamount of current can be increased. Alternatively, by using thestructure where gate electrodes are formed above and below the channel,a depletion layer can be easily formed, so that subthreshold swing canbe improved.

Note that as a transistor, for example, it is possible to use atransistor with a structure where a gate electrode is formed above achannel region, a structure where a gate electrode is formed below achannel region, a staggered structure, an inverted staggered structure,a structure where a channel region is divided into a plurality ofregions, a structure where channel regions are connected in parallel orin series, or the like. A transistor with any of a variety of structuressuch as a planar type, a FIN-type, a Tri-Gate type, a top-gate type, abottom-gate type, a double-gate type (with gates above and below achannel), and the like can be used.

Note that in this specification and the like, a transistor can be formedusing any of a variety of substrates, for example. The type of asubstrate is not limited to a certain type. As the substrate, asemiconductor substrate (e.g., a single crystal substrate or a siliconsubstrate), an SOI substrate, a glass substrate, a quartz substrate, aplastic substrate, a metal substrate, a stainless steel substrate, asubstrate including stainless steel foil, a tungsten substrate, asubstrate including tungsten foil, a flexible substrate, an attachmentfilm, paper including a fibrous material, a base material film, or thelike can be used, for example. As an example of a glass substrate, abarium borosilicate glass substrate, an aluminoborosilicate glasssubstrate, a soda lime glass substrate, or the like can be given.Examples of a flexible substrate, a flexible substrate, an attachmentfilm, a base film, or the like are as follows: a plastic typified bypolyethylene terephthalate (PET), polyethylene naphthalate (PEN), andpolyether sulfone (PES); a synthetic resin such as acrylic;polypropylene; polyester; polyvinyl fluoride; polyvinyl chloride;polyester; polyamide; polyimide; aramid; epoxy; an inorganic vapordeposition film; and paper. Specifically, the use of semiconductorsubstrates, single crystal substrates, SOI substrates, or the likeenables the manufacture of small-sized transistors with a smallvariation in characteristics, size, shape, or the like and with highcurrent capability. A circuit using such transistors achieves lowerpower consumption of the circuit or higher integration of the circuit.

Note that a transistor may be formed using one substrate, and then thetransistor may be transferred to another substrate. Examples of asubstrate to which a transistor is transferred include, in addition tothe above-described substrates over which transistors can be formed, apaper substrate, a cellophane substrate, an aramid film substrate, apolyimide film substrate, a stone substrate, a wood substrate, a clothsubstrate (including a natural fiber (e.g., silk, cotton, or hemp), asynthetic fiber (e.g., nylon, polyurethane, or polyester), a regeneratedfiber (e.g., acetate, cupra, rayon, or regenerated polyester), or thelike), a leather substrate, a rubber substrate, and the like. When sucha substrate is used, a transistor with excellent properties or atransistor with low power consumption can be formed, a device with highdurability, high heat resistance can be provided, or reduction in weightor thickness can be achieved.

Note that all the circuits needed to realize a predetermined functioncan be formed over the same substrate (e.g., a glass substrate, aplastic substrate, a single crystal substrate, or an SOI substrate).Thus, costs can be reduced by reduction in the number of components, orthe reliability can be improved by reduction in the number ofconnections to circuit components.

Note that it is possible to form not all the circuits needed to realizethe predetermined function over the same substrate. That is, a part ofthe circuits needed to realize the predetermined function can be formedover a substrate and another part of the circuits needed to realize thepredetermined function can be formed over another substrate. Forexample, a part of the circuits needed to realize the predeterminedfunction can be formed over a glass substrate and a part of the circuitsneeded to realize the predetermined function can be formed over a singlecrystal substrate (or an SOI substrate). Then, a single crystalsubstrate over which a part of the circuits needed to realize thepredetermined function (such a substrate is also referred to as an ICchip) can be connected to a glass substrate by COG (chip on glass), andan IC chip can be provided on the glass substrate. Alternatively, an ICchip can be connected to a glass substrate using TAB (tape automatedbonding), COF (chip on film), SMT (surface mount technology), a printedcircuit board, or the like. When some of the circuits are formed usingthe same substrate as a pixel portion in this manner, cost can bereduced by reduction in the number of components or reliability can beimproved by reduction in the number of connections to circuitcomponents. In particular, a circuit with high driving voltage, acircuit with high driving frequency, or the like consumes a large amountof power in many cases. In order to deal with it, such a circuit isformed over a substrate (e.g., a single crystal substrate) which isdifferent from a substrate where the pixel portion is formed, so that anIC chip is formed. By the use of this IC chip, an increase in powerconsumption can be prevented.

For example, in this specification and the like, an active matrix methodin which an active element is included in a pixel or a passive matrixmethod in which an active element is not included in a pixel can beused.

In an active matrix method, as an active element (a non-linear element),not only a transistor but also various active elements (non-linearelements) can be used. For example, an MIM (metal insulator metal), aTFD (thin film diode), or the like can also be used. Since such anelement has few numbers of manufacturing steps, manufacturing cost canbe reduced or yield can be improved. Alternatively, since the size ofthe element is small, the aperture ratio can be improved, so that powerconsumption can be reduced or higher luminance can be achieved.

As a method other than the active matrix method, the passive matrixmethod in which an active element (a non-linear element) is not used canalso be used. Since an active element (a non-linear element) is notused, the number of manufacturing steps is small, so that manufacturingcost can be reduced or yield can be improved. Alternatively, since anactive element (a non-linear element) is not used, the aperture ratiocan be improved, so that power consumption can be reduced or higherluminance can be achieved, for example.

This embodiment can be combined with any of the other embodiments inthis specification as appropriate.

Embodiment 7

In this embodiment, the structure of a display panel that can be usedfor a position input portion and a display device of the data processingdevice of one embodiment of the present invention will be described withreference to FIGS. 27A and 27B and FIG. 28. Note that the display paneldescribed in this embodiment includes a touch sensor (a contact sensordevice) that overlaps with a display portion; thus, the display panelcan be called a touch panel (an input/output device).

FIG. 27A is a schematic perspective view of a touch panel 500 describedas an example in this embodiment. Note that FIGS. 27A and 27B illustrateonly main components for simplicity. FIG. 27B is a developed view of theschematic perspective view of the touch panel 500.

FIG. 28 is a cross-sectional view of the touch panel 500 taken alongline X1-X2 in FIG. 27A.

The touch panel 500 includes a display unit 501 and a touch sensor 595(see FIG. 27B). Furthermore, the touch panel 500 includes a substrate510, a substrate 570, and a substrate 590. Note that the substrate 510,the substrate 570, and the substrate 590 each have flexibility, forexample.

Note that in this specification and the like, a transistor can be formedusing any of a variety of substrates, for example. The type of asubstrate is not limited to a certain type. As the substrate, asemiconductor substrate (e.g., a single crystal substrate or a siliconsubstrate), an SOI substrate, a glass substrate, a quartz substrate, aplastic substrate, a metal substrate, a stainless steel substrate, asubstrate including stainless steel foil, a tungsten substrate, asubstrate including tungsten foil, a flexible substrate, an attachmentfilm, paper including a fibrous material, a base material film, or thelike can be used, for example. As an example of a glass substrate, abarium borosilicate glass substrate, an aluminoborosilicate glasssubstrate, a soda lime glass substrate, or the like can be given.Examples of a flexible substrate include a flexible synthetic resin suchas plastics typified by polyethylene terephthalate (PET), polyethylenenaphthalate (PEN), and polyether sulfone (PES), and acrylic. Examples ofan attachment film are attachment films formed using polypropylene,polyester, polyvinyl fluoride, polyvinyl chloride, and the like.Examples of the material for the base film include polyester, polyamide,polyimide, inorganic vapor deposition film, and paper. Specifically, theuse of semiconductor substrates, single crystal substrates, SOIsubstrates, or the like enables the manufacture of small-sizedtransistors with a small variation in characteristics, size, shape, orthe like and with high current capability. A circuit using suchtransistors achieves lower power consumption of the circuit or higherintegration of the circuit.

The display portion 501 includes the substrate 510, a plurality ofpixels over the substrate 510, and a plurality of wirings 511 throughwhich signals are supplied to the pixels. The plurality of wirings 511is led to a peripheral portion of the substrate 510, and part of theplurality of wirings 511 forms a terminal 519. The terminal 519 iselectrically connected to an FPC 509(1).

<Touch Sensor>

The substrate 590 includes the touch sensor 595 and a plurality ofwirings 598 electrically connected to the touch sensor 595. Theplurality of wirings 598 is led to a peripheral portion of the substrate590, and part of the plurality of wirings 598 forms a terminal forelectrical connection to an FPC 509(2). Note that in FIG. 27B,electrodes, wirings, and the like of the touch sensor 595 provided onthe back side of the substrate 590 (on the back side of the diagram) areindicated by solid lines for clarity.

As a touch sensor used as the touch sensor 595, a capacitive touchsensor is preferably used. Examples of the capacitive touch sensor are asurface capacitive touch sensor and a projected capacitive touch sensor.Examples of the projected capacitive touch sensor are a self capacitivetouch sensor and a mutual capacitive touch sensor, which differ mainlyin the driving method. The use of a mutual capacitive type is preferablebecause multiple points can be sensed simultaneously.

An example of using a projected capacitive touch sensor is describedbelow with reference to FIG. 27B. Note that a variety of sensors thatcan sense the closeness or the contact of a sensing target such as afinger, can be used.

The projected capacitive touch sensor 595 includes electrodes 591 andelectrodes 592. The electrodes 591 are electrically connected to any ofthe plurality of wirings 598, and the electrodes 592 are electricallyconnected to any of the other wirings 598.

The electrode 592 is in the form of a series of quadrangles arranged inone direction as illustrated in FIGS. 27A and 27B. Each of theelectrodes 591 is in the form of a quadrangle. A wiring 594 electricallyconnects two electrodes 591 arranged in a direction intersecting withthe direction in which the electrode 592 extends. The intersecting areaof the electrode 592 and the wiring 594 is preferably as small aspossible. Such a structure allows a reduction in the area of a regionwhere the electrodes are not provided, reducing unevenness intransmittance. As a result, unevenness in luminance of light from thetouch sensor 595 can be reduced.

Note that the shapes of the electrodes 591 and the electrodes 592 arenot limited to the above-mentioned shapes and can be any of a variety ofshapes. For example, the plurality of electrodes 591 may be provided sothat space between the electrodes 591 are reduced as much as possible,and a plurality of electrodes 592 may be provided with an insulatinglayer sandwiched between the electrodes 591 and the electrodes 592 andmay be spaced apart from each other to form a region not overlappingwith the electrodes 591. In that case, between two adjacent electrodes592, it is preferable to provide a dummy electrode which is electricallyinsulated from these electrodes, whereby the area of a region having adifferent transmittance can be reduced.

The structure of the touch panel 500 is described with reference to FIG.28.

The touch sensor 595 includes the substrate 590, the electrodes 591 andthe electrodes 592 provided in a staggered arrangement on the substrate590, an insulating layer 593 covering the electrodes 591 and theelectrodes 592, and the wiring 594 that electrically connects theadjacent electrodes 591 to each other.

An adhesive layer 597 attaches the substrate 590 to the substrate 570 sothat the touch sensor 595 overlaps with the display portion 501.

The electrodes 591 and the electrodes 592 are formed using alight-transmitting conductive material. As a light-transmittingconductive material, a conductive oxide such as indium oxide, indium tinoxide, indium zinc oxide, zinc oxide, or zinc oxide to which gallium isadded can be used.

The electrodes 591 and the electrodes 592 may be formed by depositing alight-transmitting conductive material on the substrate 590 by asputtering method and then removing an unnecessary portion by any ofvarious patterning techniques such as photolithography.

The insulating layer 593 covers the electrodes 591 and the electrodes592. Examples of a material for the insulating layer 593 are a resinsuch as acrylic or epoxy resin, a resin having a siloxane bond, and aninorganic insulating material such as silicon oxide, silicon oxynitride,or aluminum oxide.

Furthermore, openings reaching the electrodes 591 are formed in theinsulating layer 593, and the wiring 594 electrically connects theadjacent electrodes 591. The wiring 594 is preferably formed using alight-transmitting conductive material, in which case the aperture ratioof the touch panel can be increased. Moreover, the wiring 594 ispreferably formed using a material that has higher conductivity thanthose of the electrodes 591 and the electrodes 592.

One electrode 592 extends in one direction, and a plurality ofelectrodes 592 is provided in the form of stripes.

The wiring 594 intersects with the electrode 592.

Adjacent electrodes 591 are provided with one electrode 592 providedtherebetween and are electrically connected by the wiring 594.

Note that the plurality of electrodes 591 is not necessarily arranged inthe direction orthogonal to one electrode 592 and may be arranged tointersect with one electrode 592 at an angle of less than 90 degrees.

One wiring 598 is electrically connected to any of the electrodes 591and 592. Part of the wiring 598 serves as a terminal. For the wiring598, a metal material such as aluminum, gold, platinum, silver, nickel,titanium, tungsten, chromium, molybdenum, iron, cobalt, copper, orpalladium or an alloy material containing any of these metal materialscan be used.

Note that an insulating layer that covers the insulating layer 593 andthe wiring 594 may be provided to protect the touch sensor 595.

Furthermore, a connection layer 599 electrically connects the wiring 598to the FPC 509(2).

As the connection layer 599, any of various anisotropic conductive films(ACF), anisotropic conductive pastes (ACP), or the like can be used.

The adhesive layer 597 has a light-transmitting property. For example, athermosetting resin or an ultraviolet curable resin can be used;specifically, a resin such as an acrylic resin, a urethane resin, anepoxy resin, or a resin having a siloxane bond can be used.

(Display Portion)

The touch panel 500 includes a plurality of pixels arranged in a matrix.Each of the pixels includes a display element and a pixel circuit fordriving the display element.

In this embodiment, an example of using an organic electroluminescentelement that emits white light as a display element will be described;however, the display element is not limited to such element.

As the display element, for example, other than organicelectroluminescent elements, any of a variety of display elements suchas display elements (electronic ink) that perform display by anelectrophoretic method, an electronic liquid powder method, or the like;MEMS shutter display elements; optical interference type MEMS displayelements; and liquid crystal elements can be used. Note that a structuresuitable for employed display elements can be selected from among avariety of structures of pixel circuits.

The substrate 510 is a stacked body in which a flexible substrate 510 b,a barrier film 510 a that prevents diffusion of unintentional impuritiesto light-emitting elements, and an adhesive layer 510 c that attachesthe barrier film 510 a to the substrate 510 b are stacked.

The substrate 570 is a stacked body in which a flexible substrate 570 b,a barrier film 570 a that prevents diffusion of unintentional impuritiesto the light-emitting elements, and an adhesive layer 570 c thatattaches the barrier film 570 a to the substrate 570 b are stacked.

A sealant 560 attaches the substrate 570 to the substrate 510. Thesealant 560, also serving as an optical adhesive layer, has a refractiveindex higher than that of air. The pixel circuits and the light-emittingelements (e.g., a first light-emitting element 550R) are providedbetween the substrate 510 and the substrate 570.

<<Structure of Pixels>>

A pixel includes a sub-pixel 502R, and the sub-pixel 502R includes alight-emitting module 580R.

The sub-pixel 502R includes the first light-emitting element 550R andthe pixel circuit that can supply electric power to the firstlight-emitting element 550R and includes a transistor 502 t.Furthermore, the light-emitting module 580R includes the firstlight-emitting element 550R and an optical element (e.g., a coloringlayer 567R).

The first light-emitting element 550R includes a lower electrode, anupper electrode, and a layer containing a light-emitting organiccompound between the lower electrode and the upper electrode.

The light-emitting module 580R includes the first coloring layer 567R onthe substrate 570. The coloring layer transmits light of a particularwavelength and is, for example, a layer that selectively transmits lightof red, green, or blue color. A region that transmits light emitted fromthe light-emitting element as it is may be provided as well.

The light-emitting module 580R includes the sealant 560 that is incontact with the first light-emitting element 550R and the firstcoloring layer 567R.

The first coloring layer 567R is positioned in a region overlapping withthe first light-emitting element 550R. Accordingly, part of lightemitted from the first light-emitting element 550R passes through thesealant 560 that also serves as an optical adhesive layer and throughthe first coloring layer 567R and is emitted to the outside of thelight-emitting module 580R as indicated by arrows in FIG. 28.

<<Structure of Display Portion>>

The display portion 501 includes a light-blocking layer 567BM on thesubstrate 570. The light-blocking layer 567BM is provided so as tosurround the coloring layer (e.g., the first coloring layer 567R).

The display portion 501 includes an anti-reflective layer 567 ppositioned in a region overlapping with pixels. As the anti-reflectivelayer 567 p, a circular polarizing plate can be used, for example.

The display portion 501 includes an insulating film 521. The insulatingfilm 521 covers the transistor 502 t. Note that the insulating film 521can be used as a layer for planarizing unevenness due to the pixelcircuit. An insulating film on which a layer that can prevent diffusionof impurities to the transistor 502 t and the like is stacked can beused as the insulating film 521.

The display portion 501 includes the light-emitting elements (e.g., thefirst light-emitting element 550R) over the insulating film 521.

The display portion 501 includes, over the insulating film 521, apartition wall 528 that overlaps with an end portion of the first lowerelectrode. In addition, a spacer that controls the distance between thesubstrate 510 and the substrate 570 is provided on the partition wall528.

<<Structure of Image Signal Line Driver Circuit>>

The image signal line driver circuit 503 s(1) includes a transistor 503t and a capacitor 503 c. Note that the image signal line driver circuit503 s(1) can be formed in the same process and over the same substrateas those of the pixel circuits.

<<Other Structures>>

The display portion 501 includes the wirings 511 through which signalscan be supplied. The wirings 511 are provided with the terminal 519.Note that the FPC 509(1) through which a signal such as an image signalor a synchronization signal can be supplied is electrically connected tothe terminal 519.

Note that a printed wiring board (PWB) may be attached to the FPC509(1).

This embodiment can be combined with any of the other embodiments inthis specification as appropriate.

Embodiment 8

In this embodiment, a method for manufacturing a foldable device thatcan be used for the data processing device or an electronic device ofone embodiment of the present invention will be described with referenceto FIGS. 29A to 29D, FIGS. 30A to 30D, and FIGS. 31A to 31D. As examplesof the foldable device, a display device, a light-emitting device, aninput device, and the like can be given. As examples of the inputdevice, a touch sensor, a touch panel, and the like can be given. Asexamples of the light-emitting device, an organic EL panel, a lightingdevice, and the like can be given. As examples of the display device, alight-emitting device, an organic EL panel, a liquid crystal displaydevice, and the like can be given. Note that functions of an inputdevice such as a touch sensor and the like are provided in the displaydevice and or the light-emitting device in some cases. For example, acounter substrate (e.g., a substrate not provided with a transistor)included in the display device or the light-emitting device is providedwith a touch sensor in some cases. Alternatively, an element substrate(e.g., a substrate provided with a transistor) included in the displaydevice or the light-emitting device is provided with a touch sensor insome cases. Alternatively, the counter substrate included in the displaydevice or the light-emitting device and the element substrate includedin the display device or the light-emitting device are provided withtouch sensors in some cases.

First, a separation layer 703 is formed over a formation substrate 701,and a layer 705 to be separated is formed over the separation layer 703(FIG. 29A). Furthermore, a separation layer 723 is formed over aformation substrate 721, and a layer 725 to be separated is formed overthe separation layer 723 (FIG. 29B).

Furthermore, in the case of using a tungsten film as a separation layer,a tungsten oxide film can be formed on a surface of the tungsten film byany of the following methods: performing a plasma treatment over thesurface of the tungsten film using a gas containing oxygen such as N₂O,annealing the tungsten film in a gas atmosphere containing oxygen.Alternatively, a tungsten oxide film can be formed by method such assputtering in gas atmosphere containing oxygen. In this manner, theoxide tungsten film may be formed between a separation layer and a layerto be separated.

In a separating and transferring process of the tungsten oxide film, itis preferable that the tungsten oxide film be mainly WO_(x) whose x issmaller than 3. In the case where WO_(x) is W_(n)O_((3n−1)) orW_(n)O_((3n−2)), which is a homologous series, shear is easily caused byheating because there is a crystal optical shear plane therein. Thetungsten oxide film is formed, so that separation of the layer to beseparated from a substrate can be performed with small force.

Alternatively, it is also possible that a tungsten film is not formedand only the tungsten oxide film is formed as the separation layer. Forexample, the tungsten oxide film may be formed by the following methods:performing a plasma treatment using a gas containing oxygen with respectto a sufficiently thin tungsten film, annealing the sufficiently thintungsten film in a gas atmosphere containing oxygen. Alternatively, thetungsten oxide film may be formed by a method such as a sputteringmethod in a gas atmosphere containing oxygen.

Here, when the tungsten oxide film is separated at the interface withthe layer to be separated, the tungsten oxide film remains on the layerto be separated side in some cases. When the tungsten oxide filmremains, the characteristics of the transistor are adversely affected insome cases. Thus, after a step of separating the separation layer andthe layer to be separated, the step of removing the tungsten oxide filmis preferably included. In the above method of separating from thesubstrate, N₂O plasma treatment is not necessarily performed, and thestep of removing the tungsten oxide film can be omitted. In that case,the device can be manufactured more easily.

Furthermore, in one embodiment of the present invention, a tungsten filmwith a thickness of greater than or equal to 0.1 nm and less than 200 nmis formed over the substrate.

As the separation layer, a film containing molybdenum, titanium,vanadium, tantalum, silicon, aluminum, or an alloy thereof can be used,besides a tungsten film. Furthermore, it is also possible to use a stackof such a film and an oxide film. The separation layer is not limited toan inorganic film, and an organic film such as polyimide may be used.

In the case of using an organic resin for the separation layer, aprocess temperature needs to be lower than or equal to 350° C. whenpolysilicon is used as an active layer of the transistor. Thus,dehydrogenation baking for silicon crystallization, hydrogenation fortermination of defects in silicon, or activation of a doped regioncannot be performed sufficiently, so that the performance of thetransistor is limited. On the other hand, in the case of using aninorganic film, the process temperature can be higher than 350° C., andexcellent characteristics of a transistor can be obtained.

In the case of using the organic resin for the separation layer, theorganic resin or a functional element is damaged by laser irradiation atthe time of crystallization; thus, it is preferable to use an inorganicfilm for the separation layer because such a problem is not caused.

Furthermore, in the case of using the organic resin for the separationlayer, the organic resin shrinks by laser irradiation for separating theresin and contact failure is caused in the contact portion of theterminal of an FPC or the like, which makes it difficult for functionalelements with many terminals a high-definition display of FPC, or thelike to separate and transpose with high yield. In the case of using aninorganic film for the separation layer, there is no such limitation,and functional elements with many terminals of high-definition displayand the like, or the like can be separated and transferred with highyield.

In the method for separating and transferring the functional elementfrom the substrate of one embodiment of the present invention, aninsulating film and a transistor can be formed over the formationsubstrate at a temperature of lower than or equal to 600° C. In thatcase, a high-temperature polysilicon or CG silicon (registeredtrademark) can be used for a semiconductor layer. With use of aconventional production line for high-temperature polysilicon or CGsilicon (registered trademark), a semiconductor device with a highoperation speed, a high gas barrier property, and high reliability canbe mass-produced. In that case, with use of the insulating layer and thetransistor formed through the process at the temperature of lower thanor equal to 600° C., insulating layers having an excellent gas barrierproperty formed at the temperature of lower than or equal to 600° C. canbe provided above and below an organic EL element. Accordingly, entry ofimpurities such as moisture into the organic EL element or thesemiconductor layer can be suppressed, whereby an extraordinarilyreliable light-emitting device can be obtained as compared with the caseof using the organic resin or the like as the separation layer.

Alternatively, the insulating layer and the transistor can be formedover the formation substrate at 500° C. or lower. In that case,low-temperature polysilicon or an oxide semiconductor can be used forthe semiconductor layer, and mass production is possible with use of aconventional production line for low temperature polysilicon. Also inthat case, with use of the insulating layer and the transistor formedthrough the process at the temperature of lower than or equal to 500°C., insulating layers having an excellent gas barrier property formed atthe temperature of lower than or equal to 500° C. can be provided aboveand below the organic EL element. Accordingly, the entry of impuritiessuch as moisture into the inorganic EL element or the semiconductorlayer is suppressed, whereby a highly reliable light-emitting device canbe obtained as compared with the case of using the organic resin as theseparation layer.

Alternatively, the insulating layer and the transistor can be formedover the formation substrate at 400° C. or lower. In that case,amorphous silicon or the oxide semiconductor can be used for thesemiconductor layer, and mass production is possible with use of aconventional production line for amorphous silicon. Also in that case,with use of the insulating layer and the transistor formed through theprocess at the temperature of 400° C. or lower, the insulating layershaving an excellent gas barrier property formed at the temperature of400° C. or lower can be provided above and below the organic EL element.Accordingly, entry of impurities such as moisture into the organic ELelement or the semiconductor layer is suppressed, whereby a highlyreliable light emitting device can be obtained as compared with a caseof using the organic resin and the like as the separation layer.

Next, the formation substrate 701 and the formation substrate 721 areattached to each other by using a bonding layer 707 and a frame-shapedbonding layer 711 so that the surfaces over which the layers to beseparated are formed face each other, and then, the bonding layer 707and the frame-shaped bonding layer 711 are cured (FIG. 29C). Here, theframe-shaped bonding layer 711 and the bonding layer 707 in a regionsurrounded by the frame-shaped bonding layer 711 are provided over thelayer 725 to be separated and after that, the formation substrate 701and the formation substrate 721 face each other and are attached to eachother.

Note that the formation substrate 701 and the formation substrate 721are preferably attached to each other in a reduced-pressure atmosphere.

Note that although FIG. 29C illustrates the case where the separationlayer 703 and the separation layer 723 are different in size, separationlayers of the same size as illustrated in FIG. 29D may be used.

The bonding layer 707 is provided to overlap with the separation layer703, the layer 705 to be separated, the layer 725 to be separated, andthe separation layer 723. Then, an end portion of the bonding layer 707is preferably positioned on an inner side of at least an end portion ofeither the separation layer 703 or the separation layer 723 (theseparation layer which is desirably separated from the substrate first).Accordingly, strong adhesion between the formation substrate 701 and theformation substrate 721 can be suppressed; thus, a decrease in the yieldof a subsequent separation process can be suppressed.

Next, a first separation trigger 741 from the substrate is formed bylaser light irradiation (FIGS. 30A and 30B).

Either the formation substrate 701 or the formation substrate 721 may beseparated first. In the case where the separation layers differ in size,a substrate over which a larger separation layer is formed may beseparated first or a substrate over which a smaller separation layer isformed may be separated first. In the case where an element such as asemiconductor element, a light-emitting element, or a display element isformed only over one of the substrates, the substrate on the side wherethe element is formed may be separated first or the other substrate maybe separated first. Here, an example in which the formation substrate701 is separated first is described.

A region where the bonding layer 707 in a cured state or theframe-shaped bonding layer 711 in a cured state, the layer 705 to beseparated, and the separation layer 703 overlap with one another isirradiated with laser light. Here, the bonding layer 707 is in a curedstate and the frame-shaped bonding layer 711 is not in a cured state,and the bonding layer 707 in a cured state is irradiated with laserlight (see an arrow P3 in FIG. 30A).

The first separation trigger 741 (see a region surrounded by a dashedline in FIG. 30B) can be formed by cracking (causing break or crack) atleast the first layer (a layer provided between the layer 705 to beseparated and the separation layer 703, e.g., a tungsten oxide film). Atthis time, not only the first layer but also the separation layer 703,the bonding layer 707, or another layer included in the layer 705 to beseparated may be partly removed.

It is preferable that laser light irradiation be performed from thesubstrate side provided with the separation layer that is desirablyseparated. In the case where a region where the separation layer 703 andthe separation layer 723 overlap with each other is irradiated withlaser light, the formation substrate 701 and the separation layer 703can be selectively separated by cracking only the layer 705 to beseparated between the layer 705 to be separated and the layer 725 to beseparated (see a region surrounded by a dotted line in FIG. 30B).

When the separation trigger from the substrate is formed in both thelayer 705 to be separated on the separation layer 703 side and the layer725 to be separated on the separation layer 723 side in the case wherethe region where the separation layer 703 and the separation layer 723overlap with each other is irradiated with laser light, it might bedifficult to selectively separate one of the formation substrates.Therefore, laser light irradiation conditions might be restricted sothat only one of the layers to be separated is cracked. The firstseparation trigger 741 from the substrate may be formed by a sharp knifesuch as a cutter, without limitation to the laser light irradiation, orthe like.

Then, the layer 705 to be separated and the formation substrate 701 areseparated from each other from the formed first separation trigger 741(FIGS. 30C and 30D). Accordingly, the layer 705 to be separated can betransferred from the formation substrate 701 to the formation substrate721.

The layer 705 which is separated from the formation substrate 701 in thestep in FIG. 30D is attached to a substrate 731 with a bonding layer733, and the bonding layer 733 is cured (FIG. 31A).

Next, a second separation trigger 743 from the substrate is formed by asharp knife such as a cutter (FIGS. 31B and 31C). The second separationtrigger 743 from the substrate is formed by the laser light irradiation,without limitation to the sharp knife such as a cutter, or the like.

In the case where the substrate 731 on the side where the separationlayer 723 is not provided can be cut by a knife or the like, a cut maybe made in the substrate 731, the bonding layer 733, and the layer 725to be separated (see arrows P5 in FIG. 31B). Accordingly, part of thefirst layer can be removed; thus, the second separation trigger 743 fromthe substrate can be formed (see a region surrounded by a dashed line inFIG. 31C).

As illustrated in FIGS. 31B and 31C, in the case where the formationsubstrate 721 and the substrate 731 are attached to each other using thebonding layer 733 in a region not overlapping with the separation layer723, yield of a process for separation from the substrate might bedecreased depending on a degree of adhesion between the formationsubstrate 721 side and the substrate 731 side. Therefore, it ispreferable to make a cut in a frame shape in a region where the bondinglayer 733 in a cured state and the separation layer 723 overlap witheach other to form the second separation trigger 743 from the substratein a form of a solid line. Accordingly, the yield of a process forseparation from the substrate can be improved.

Then, the layer 725 to be separated and the formation substrate 721 areseparated from each other from the formed second separation trigger 743from the substrate (FIG. 31D). Accordingly, the layer 725 to beseparated can be transferred from the formation substrate 721 to thesubstrate 731.

For example, in the case where the tungsten oxide film, which is tightlyanchored by N₂O plasma or the like is formed on an inorganic film suchas a tungsten film, adhesion can be relatively high in deposition. Afterthat, when a separation trigger is formed, cleavage occurs therefrom,whereby a layer to be separated is easily separated from the formationsurface and transferred to another substrate.

The formation substrate 721 and the layer 725 to be separated may beseparated by filling the interface between the separation layer 723 andthe layer 725 to be separated with a liquid such as water. A portionbetween the separation layer 723 and the layer 725 to be separatedabsorbs a liquid through capillarity action, whereby an adverse effect(e.g., a phenomenon in which a semiconductor element is damaged bystatic electricity) on the functional element such as an FET included inthe layer 725 to be separated due to static electricity caused at thetime of separation from the substrate can be suppressed.

When a bond of M-O—W (M represents a given element) is divided byapplication of physical force, a liquid is absorbed in the separationportion, whereby the bond becomes a bond of M-OH HO—W and the separationis promoted.

Note that a liquid may be sprayed in an atomized form or in a vaporizedform. As the liquid, pure water, an organic solvent, or the like can beused; a neutral, alkaline, or acid aqueous solution, an aqueous solutionin which salt is dissolved, and the like may be used.

The temperature of the liquid and the substrate at the time of dynamicseparation is set in the range from room temperature to 120° C., andpreferably set to 60° C. to 90° C.

In the method for separation from the substrate of one embodiment of thepresent invention described above, separation of the formation substrateis performed in such a manner that the second separation trigger 743from the substrate is formed by a sharp knife or the like so that theseparation layer and the layer to be separated are made in a state whereseparating can be easily performed. Accordingly, the yield of theprocess for separation from substrate can be improved.

In addition, bonding of a substrate with which a device is to be formedcan be performed after the following procedure: a pair of formationsubstrates each provided with the layer to be separated are attached toeach other and then, separating each formation substrate is performed.This means that formation substrates having low flexibility can beattached to each other when the layers to be separated are attached toeach other. Accordingly, alignment accuracy at the time of attachmentcan be improved as compared to the case where flexible substrates areattached to each other.

Note that this embodiment can be combined with any of the otherembodiments and examples described in this specification as appropriate.

EXPLANATION OF REFERENCE

-   100: data processing device, 101: housing, 110: arithmetic unit,    111: arithmetic portion, 112: memory portion, 114: transmission    path, 115: input/output interface, 120: input/output unit, 130:    display portion, 131: keyboard, 140: position input portion, 141:    substrate, 142: proximity sensor, 145: input/output portion, 150:    sensor portion, 151: sensor, 152: arrow, 159: sign, 160:    communication portion, 300: input/output unit, 301: display portion,    302: pixel, 308: imaging pixel, 309: FPC, 310: substrate, 311:    wiring, 319: terminal, 321: insulating film, 328: partition wall,    329: spacer, 352: upper electrode, 353: layer, 354: intermediate    layer, 360: sealant, 370: counter substrate, 500: touch panel, 501:    display portion, 509: FPC, 510: substrate, 511: wiring, 519:    terminal, 521: insulating film, 528: partition wall, 560: sealant,    570: substrate, 590: substrate, 591: electrode, 592: electrode, 593:    insulating layer, 594: wiring, 595: touch sensor, 597: adhesive    layer, 598: wiring, 599: connection layer, 100B: data processing    device, 120B: input/output unit, 130B: display portion, 13 a:    connecting member, 13 b: connecting member, 140(1): region, 140(2):    region, 140(3): region, 140(4): region, 140(5): region, 140B:    position input portion, 140B(1): region, 140B(2): region, 140B(3):    region, 15 a: supporting member, 15 b: supporting member, 302B:    sub-pixel, 302G: sub-pixel, 302R: sub-pixel, 302 t: transistor, 303    c: capacitor, 303 g(1): scan line driver circuit, 303 g(2): imaging    pixel driver circuit, 303 s(1): image signal line driver circuit,    303 s(2): imaging signal line driver circuit, 303 t: transistor, 308    p: photoelectric conversion element, 308 t: transistor, 310 a:    barrier film, 310 b: substrate, 310 c: adhesive layer, 350R:    light-emitting element, 351R: lower electrode, 353 a: light-emitting    unit, 353 b: light-emitting unit, 367BM: light-blocking layer, 367    p: anti-reflective layer, 367R: coloring layer, 370 a: barrier film,    370 b: substrate, 370 c: adhesive layer, 380B: light-emitting    module, 380G: light-emitting module, 380R: light-emitting module,    502R: sub-pixel, 502 t: transistor, 503 c: capacitor, 503 s: image    signal line driver circuit, 503 t: transistor, 510 a: barrier film,    510 b: substrate, 510 c: adhesive layer, 550R: light-emitting    element, 567BM: light-blocking layer, 567 p: anti-reflective layer,    567R: coloring layer, 570 a: barrier film, 570 b: substrate; 570 c:    adhesive layer, 580R: light-emitting module, 701: formation    substrate, 703: separation layer, 705: layer to be separated, 707:    bonding layer, 711: frame-shaped bonding layer, 721: formation    substrate, 723: separation layer, 725: layer to be separated; 731:    substrate, 733: bonding layer, 741: first separation trigger, and    743: second separation trigger.

This application is based on Japanese Patent Application serial no.2013-248392 filed with Japan Patent Office on Nov. 29, 2013, the entirecontents of which are hereby incorporated by reference.

What is claimed is:
 1. A driving method of a data processing devicecomprising steps of: determining a finger of a user that is used foroperation of the portable data-processing device by sensing touch of thefinger at a first side surface or a second side surface of the portabledata-processing device; and displaying images used for the operation ofthe portable data-processing device on a display portion so that animage frequently used for the operation is displayed nearer to thefinger than an image less frequently used for the operation.
 2. Thedriving method according to claim 1, wherein the first and second sidesurfaces are configured to display an image.
 3. The driving methodaccording to claim 1, wherein the first and second side surfaces and thedisplay portion each comprise a touch sensor.
 4. The driving methodaccording to claim 1, wherein the second side surface faces the firstside surface with the display portion therebetween, and wherein thedisplay portion is in contact with the first and second side surfaces.5. The driving method according to claim 1, wherein the step ofdetermining comprises: defining a figure as a contact region; anddetermining a central coordinates of the figure whose area is largerthan a predetermined area.
 6. The driving method according to claim 1,wherein the step of determining comprises: defining a line segment as alength of a contact region; and determining midpoint coordinates of theline segment whose length is longer than a predetermined length.